Polycrystalline silicon numerically controlled grinder

Abstract

A polycrystalline silicon numerically controlled grinder comprises a machine base, grinding mechanisms and a movable screw rod which is arranged in the longitudinal direction. A screw nut which fits in with the movable screw rod is arranged in a screw nut seat through an axletree. The screw nut is connected with an output end of a movable motor through a transmission mechanism. The movable motor is fixed on the screw nut seat. A movable sliding table is fixedly connected with the screw nut seat. The movable sliding table is connected with the machine base in a sliding mode. A clamp body is connected with the movable sliding table. A left clamp head body is fixedly connected with the left end of the clamp body. The clamp body is provided with a clamping screw rod in a supporting mode. The clamping screw rod is connected with an output shaft of a clamping motor. A clamping screw nut which fits in with the clamping screw rod is connected with a right clamp head body. A left clamp head is connected with the left clamp head body in a rotating mode. A right clamp head is connected with the right clamp head body in the rotating mode. The left clamp head is connected with a rotating mechanism. The polycrystalline silicon numerically controlled grinder has the advantages of being simple in whole structure, flexible and reliable in movement, high in efficiency, accurate in size controlling, good in stability, and capable of reducing machining cost due to the fact that two groups of opposite side faces and chamfers of a workpiece are grinded after the workpiece is clamped once.

Description

technical field [0001] The invention relates to a device for grinding workpieces, in particular to a numerically controlled grinding machine for polycrystalline silicon blocks. Background technique [0002] The current polysilicon square grinding machine tool includes a machine base on which a symmetrical grinding head mechanism is arranged. After the silicon square is clamped once on the workpiece table, only the opposite two sides of the silicon square can be ground. Grinding of the other two opposite sides needs manual reloading and unloading of the silicon side before grinding. The silicon square chamfer grinding process needs to be carried out separately on the silicon square chamfer grinding processing equipment, and the grinding method is the same as that of the side grinding machine tool. The structure of the machine tool is: double-sided horizontal configuration, the feed slide table is set on the base of the machine tool, and the grinding head is located on both s...

AI Technical Summary

Problems solved by technology

In addition, not only the processing efficiency is low, the chip removal condition is poor, but also due to factors such as repeated clamping of the silicon square, this increases the uncertainty factors in the processing process, and it is difficult to fully and effectively control the machining accuracy and precision of the silicon square. stability

In addition, the same production volume will increase the demand for equipment and increase the cost of use

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