Cleaning machine with twin-jet nozzle

A cleaning device and double-nozzle technology are applied in spraying devices, cleaning methods and appliances, cleaning methods using liquids, etc., which can solve the problems that particles on the surface of the wafer cannot be washed away, and achieve simple structure, rapid response, and low price. Effect

Active Publication Date: 2013-05-08
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the traditional cleaning method cannot fully and effectively wash away the particles on the surface of the wafer, the purpose of the present invention is to provide a dual-nozzle cleaning device

Method used

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  • Cleaning machine with twin-jet nozzle

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 , figure 2 As shown, the present invention includes a nozzle electric cylinder 1, a spindle motor 2, a wafer holder 3, a housing 4, a nozzle arm 7, a spindle 9 and a workbench 10, wherein the spindle motor 2 is installed on the workbench 10, and the spindle 9 One end of the wafer is connected to the output end of the spindle motor 2, and the other end is equipped with a wafer table 3, and the wafer 8 is fixed on the wafer table 3, driven by the spindle motor 2 to rotate together with the wafer table 3. Outward rotation of the wafer platform 3 is provided with a housing 4 installed on the workbench 10, the housing 4 is cylindrical, used to collect the liquid that has cleaned the wafer 8, and the wafer platform 3 is located at the inside of the housing 4. middle. The nozzle electric cylinder 1 is installed on one side of the workbenc...

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Abstract

The invention relates to the equipment which is used for cleaning the chip in the workpiece process of semiconductor chips, in particular to a cleaning machine with a twin-jet nozzle used for optimizing the washing of the surface of the chip. The cleaning machine comprises a nozzle electric cylinder, a spindle motor, a supporting stage, a shell body, a nozzle arm, a spindle and a workbench. The spindle motor is installed on the workbench and one end of the spindle is connected with an output end of the spindle motor and the other end of the spindle motor is installed inside the shell body of the workbench. The other end of the spindle is connected with the supporting stage used for fixing and rotating the chip. The nozzle electric cylinder is installed on one side of the workbench and one end of the nozzle arm is connected with the nozzle electric cylinder and is in reciprocating motion through the drive of the nozzle electric cylinder. The other end of the nozzle arm is located above the chip and the other end of the nozzle arm is provided with the twin-jet nozzle corresponding to the chip. The cleaning machine with the twin-jet nozzle can meet the cleaning demand to the hilt through the control of the position of the nozzle and the characteristic of the rotation of the chip in the cleaning process and achieve the cleaning goal that all particles on the surface of the chip are cleared away.

Description

technical field [0001] The invention relates to equipment for cleaning wafers during semiconductor wafer processing, in particular to a dual-nozzle cleaning device for optimizing the cleaning of the wafer surface. Background technique [0002] Currently, semiconductor wafer processing requires a highly clean environment to reduce the impact of unwanted particles on the process. However, with the continuous improvement of precision, the continuous reduction of line width and the continuous improvement of cleanliness requirements, not only a high-cleanliness purification environment is required, but also the surface of the wafer needs to be cleaned in many cases to meet the needs of the processed wafers. Surface cleanliness requirements. [0003] The original wafer cleaning method is to fix the wafer on the wafer holder by vacuum adsorption, and use the method of direct rinsing with deionized water to clean the surface of the lens. In this way, relying on the centrifugal for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B3/02B05B15/10
Inventor 张浩渊
Owner SHENYANG KINGSEMI CO LTD
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