Packaging method of light-emitting diode (LED) device

A technology of LED device and packaging method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of low luminous efficiency, waste of raw materials, and complicated packaging process, and achieves the advantages of simple packaging process, simplified installation process, and improved luminous efficiency. Effect

Inactive Publication Date: 2013-05-08
AD TOYO LIGHTING GUANGZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problems existing in the prior art, especially to solve the problems of low lumino

Method used

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  • Packaging method of light-emitting diode (LED) device
  • Packaging method of light-emitting diode (LED) device
  • Packaging method of light-emitting diode (LED) device

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Embodiment

[0028] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings.

[0029] like figure 1 and figure 2 As shown, a packaging method for an LED device, comprising:

[0030] Packaging of the light source: the LED light source chip is directly packaged in the light source packaging area 1 of the ceramic substrate by COB packaging;

[0031] Packaging of the driving circuit: directly package all components of the driving circuit in the driving circuit packaging area 2 of the ceramic substrate with bare chips;

[0032] The setting of the input line pad 3: the input line pad 3 adopts the printed circuit technology, and is directly printed on the position of the input line pad 3 of the ceramic substrate;

[0033] The setting of circuit board wire hole 4: open a hole in the middle of the ceramic substrate, pass the input power line through this hole, and connect it to the input line pad 3.

[0034] Preferably, ...

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Abstract

The invention relates to a packaging method of a light-emitting diode (LED) device. The packaging method of the LED device comprises the following steps. A light source is packaged, and the LED light source is packaged in a light source packaging zone by utilizing chip on board (COB) technology. A drive circuit is packaged, and all the elements of the drive circuit are also directly packaged in a drive circuit packaging zone on a light source circuit board. Wire inputting pads are printed at two ends of a wire passing hole so that power wires can be conveniently input in a welding mode. The light source packaging zone and the drive circuit packaging zone are fixed, and the drive circuit packaging zone is fixed on the light source packaging zone to form a LED device main body. According to the packaging method of the Led device, a light and electric integrated module with high integration density is achieved. The COB packaging technology is utilized by the light source in the design method, materials of secondary packaging and a device support frame are removed, and cost is greatly reduced. Packaging procedures are simple and convenient, and size is greatly reduced so that light-emitting efficiency of the LED light source is improved. The design method of integration of the light source and a drive removes a position special for placing the drive in the design of the whole light, installation technology is simplified, and cost in whole light installation and production is greatly reduced, and the method of the LED device is suitable for massive automatic production.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a packaging method for an LED device. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. In the field of LED lighting, the packaging technology and method of LED devices play a key role in the luminous efficiency (light extraction efficiency) of light-emitting diodes. In the prior art, the packaging techniques and methods for improving the luminous efficiency of high-power LED devices for lighting can be roughly divided into the following categories: [0003] 1. Directly use LEDs with high luminous efficiency as raw materials. This method can improve the luminous efficiency of the lighting device within a limited range, but the luminous efficiency of eac...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/62
Inventor 关崇安
Owner AD TOYO LIGHTING GUANGZHOU
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