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High-frequency substrate structure

A substrate and high-frequency technology, applied in the field of high-frequency substrates, can solve problems such as low surface energy, low yield, and high cost, and achieve the effects of improved processability, good production yield, and easy production

Active Publication Date: 2013-05-08
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when fluorine-based resins are bonded by high-temperature thermocompression, the processing is difficult, resulting in poor production yields, and the thermal expansion coefficient is different from that of the metal layer, so it is impossible to use automated equipment for mass production, and the cost is high. In addition, the surface properties of fluorine-based resins With extremely low surface energy, it is not easy to adhere to the metal, causing delamination, and the yield rate is not high

Method used

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Embodiment 1

[0021] Embodiment 1: A high-frequency substrate structure 100 is provided with a dielectric layer 110. The dielectric layer has two opposite surfaces and are respectively a first surface 110a and a second surface 110b. The second surface of the dielectric layer The first surface 110a and the second surface 110b have a rough structure 1101 with concavo-convex connections. A first adhesive layer 111 and a second adhesive layer 112 are adhered to the first surface 110a and the second surface 110b of the dielectric layer 110 respectively, and a first metal layer 115 is provided, and the first metal 115 is adhered to On the first adhesive layer 111, the first adhesive layer 111 is interposed between the first metal layer 115 and the dielectric layer 110, and the second adhesive layer 112 is adhered with a first poly An imide layer 113, a second metal layer 116 is adhered on the first polyimide layer 113, and the first polyimide layer 113 is sandwiched between the second adhesive la...

Embodiment 2

[0027] Embodiment 2: A high-frequency substrate structure 200 is provided with a dielectric layer 220. The dielectric layer has two opposite surfaces and are respectively a first surface 220a and a second surface 220b. The second surface of the dielectric layer The first surface 220a and the second surface 220b have a rough structure 2201 with concavo-convex connections. A first adhesive layer 221 and a second adhesive layer 222 are attached to the first surface 220a and the second surface 220b of the dielectric layer 220 respectively, and a first metal layer 225 and a second polyimide layer 224 are provided, The second polyimide layer 224 is adhered to the first adhesive layer 221, the first metal layer 225 is adhered to the second polyimide layer 224, and the second polyimide layer The imide layer 224 is interposed between the first metal layer 225 and the first adhesive layer 221, the second adhesive layer 222 is adhered with a first polyimide layer 223, the first polyimide...

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Abstract

The invention discloses a high-frequency substrate structure. A dielectric layer is provided with two opposite surfaces, namely a first surface and a second surface, wherein a first adhesive layer and a second adhesive layer are respectively attached to the first surface and the second surface of the dielectric layer in a bonding mode. The high-frequency substrate structure is provided with a first metal layer, wherein the first adhesive layer is located between the first metal layer and the dielectric layer, a first polyimide layer is attached to the second adhesive layer in a bonding mode, and a second metal layer is attached to the first polyimide layer in a bonding mode. According to the high-frequency substrate structure, one adhesive layer is arranged between the dielectric layer and each metal layer; since the adhesive layers have proper adhesive force, the adhesive layers can be easily attached to the surfaces of the dielectric layer without any gap, and the dielectric layer and the polyimide layer are enabled to be placed between the metal layers through the adhesive layers in a sandwiched mode; and through the formation of the adhesive layers, the processability of the dielectric layer in a lamination process can be improved, and the high-frequency substrate structure further has the advantages of being simple and convenient to manufacture, low in cost and high in yield rate.

Description

technical field [0001] The invention relates to a high-frequency substrate. Background technique [0002] Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing day by day. Due to the characteristics of flexibility and three-dimensional wiring, flexible printed circuit boards are currently widely used in computers and their peripheral equipment, Communication products and consumer electronics products, etc. [0003] Recently, due to the trend of high-speed and high-frequency application of electronic products, today's electronic products need to be supported by printed circuit boards for high-frequency circuits to achieve high-frequency and high-speed operation. Among the many materials used as printed circuit boards for high-frequency circuits, in addition to ceramics and foam materials, fluorine-based resins are mostly used because they have ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 林志铭洪金贤林惠峰李建辉
Owner KUSN APLUS TEC CORP