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Method and device for sealing with frit and frit

A glass frit and sealing glass technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of limited light absorption, high heating of glass substrates, and easy cracking, so as to enhance light absorption and reduce defective rate , the effect of improving the quality

Active Publication Date: 2013-05-15
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, materials such as Cu and Fe have limited ability to absorb light. In the process of melting the sealing glass, a high-power laser needs to be applied, which causes the upper and lower glass substrates to be heated too high and prone to the risk of cracking.

Method used

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  • Method and device for sealing with frit and frit

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] An embodiment of the present invention provides a glass frit, the glass frit includes a sealing glass and a filler, wherein the filler includes an inorganic quantum dot material.

[0032] Due to its quantum effect, the quantum dot material has excellent properties different from bulk materials and general materials, and can be used as a light-emitting and light-absorbing material in the field of optoelectronics.

[0033] Wherein, the inorganic quantum d...

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PUM

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Abstract

The embodiment of the invention provides a method and a device for sealing with frit and frit. The light absorption of the frit is improved, the reject ratio of an OLED substrate is reduced, and the quality of the OLED substrate is improved. The frit comprises sealing glass and filler, wherein the filler comprises an inorganic quantum dot material. The embodiment of the invention relates to the field of sealing technology.

Description

technical field [0001] The invention relates to the field of sealing technology, in particular to a sealing method, device and glass frit using glass frit. Background technique [0002] OLED (Organic Light-Emitting Diode), as a new type of flat-panel display, has the characteristics of active luminescence, high luminance, high resolution, wide viewing angle, fast response, low energy consumption and flexibility. , has received more and more attention, and has become a next-generation display technology that may replace liquid crystal displays. [0003] Organic layer materials that are extremely sensitive to water vapor and oxygen exist in current OLED devices, which greatly reduces the lifespan of OLED display devices. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside world, so that the sealing performance can be achieved: the water vapor content is less than 10 -6 g / m 2 / ...

Claims

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Application Information

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IPC IPC(8): C03C8/24H01L27/32
Inventor 王丹
Owner BOE TECH GRP CO LTD
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