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Polyimide precursor composition and wiring circuit board employing the composition

A polyimide precursor, wiring circuit substrate technology, applied in the direction of circuits, printed circuits, printed circuits, etc., can solve problems such as insufficient reduction, and achieve the effect of excellent PI etching properties

Inactive Publication Date: 2013-05-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the hygroscopic expansion coefficient of the polyimide formed by the polyimide precursor as described above is not sufficiently reduced. In order to improve the suspension stability of the magnetic head on the hard disk, it is necessary to further improve the polyimide precursor. body material

Method used

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  • Polyimide precursor composition and wiring circuit board employing the composition
  • Polyimide precursor composition and wiring circuit board employing the composition
  • Polyimide precursor composition and wiring circuit board employing the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0107] Fabrication of Polyimide Resin Film

[0108] Coat the solution of the photosensitive polyamic acid composition A above with a spin coater on a stainless steel foil (SUS304) with a thickness of 20 μm, and then heat and dry at 170°C for 10 minutes to form the photosensitive polyamic acid composition A. film (thickness 14μm). Next, the film is irradiated with ultraviolet light (wavelength 365nm, 400mJ / cm 2 ), heated at 185°C for 3 minutes. Furthermore, the polyimide resin film with stainless steel foil was produced by heating to 350 degreeC and hardening (imidization) under the air pressure of 10 Pa or less. Then, the above-mentioned stainless steel foil was removed using a ferric chloride solution. In this way, a polyimide resin film for characteristic evaluation was produced.

[0109] Fabrication of printed circuit board with polyimide resin cover layer

[0110]On the other hand, on a stainless steel foil (SUS304) with a thickness of 20 μm, a polyimide resin lay...

Embodiment 2~6

[0112] Embodiment 2~6, comparative example 1~4

[0113] The photosensitive polyamic acid composition shown in Table 3 mentioned later was used. Other than that, a polyimide resin film and a wired circuit board with a cover layer made of polyimide resin were produced in the same manner as in Example 1.

[0114] Using the polyimide resin film obtained in this way, its characteristic evaluation (linear expansion coefficient, hygroscopic expansion coefficient, PI etching property) was measured and evaluated according to the method mentioned later. In addition, using the printed circuit board with a polyimide resin cover layer produced by the above-mentioned method, the contact between the cover layer formed of polyimide resin and the conductor part was visually observed according to the following method. debonding at the interface. These results are collectively shown in Table 3 below.

[0115] Linear expansion coefficient

[0116] The said polyimide resin film was cut int...

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Abstract

The present invention relates to a polyimide precursor composition and a wiring circuit board employing the composition. The polyimide precursor composition has polyimide material which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient, suppresses warpage attributable to the influence of temperature and humidity, permits polyimide etching (PI etching), and prevents separation in an interface between a cured polyimide film and a wiring circuit pattern of a wiring circuit board. The polyimide precursor composition comprises (A), and at least one of (B) and (C), (B) and (C) being present in a proportion of 30-100 parts by weight based on 100 parts by weight of (A): (A) a polyimide precursor comprising: (a1) a unit of formula (1): R1 is a C1-C3 alkyl group connected to an aromatic ring, m is 0 or not greater than 4, and n is 1 to 4; and (a2) a unit of formula (2): (a1) and (a2) are present in a molar ratio of 20 / 80 to 70 / 30; (B) is an imide acrylate compound represented by the formula (3). (C) is a polyethylene glycol compound represented by the formula (4).

Description

technical field [0001] The present invention relates to, for example, a polyimide precursor composition used for production of a hard disk drive suspension substrate and the like, and a wired circuit board using the same. This polyimide forming material has both a low linear expansion coefficient and a low hygroscopic expansion coefficient, suppresses the occurrence of warpage caused by the influence of temperature and humidity, and is capable of polyimide etching (PI etching). Cured polyimide No peeling occurred at the interface between the amine film and the wiring circuit pattern on the wiring circuit board. Background technique [0002] In recent years, hard disk drives (hereinafter sometimes abbreviated as "HDD") incorporated in personal computers have been required to increase in capacity and speed up information transmission. Among the components constituting such an HDD, there is a component called a magnetic head, and a component called a head suspension as a compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004H05K3/28
CPCG03F7/0387H01L21/00H05K3/287G03F7/004H05K2201/0154H05K3/28
Inventor 日紫喜智昭疋田贵巳坂仓孝俊
Owner NITTO DENKO CORP