Production method of filler blocks in production of rigid-flex printed circuit boards

Abstract

The invention provides a production method of filler blocks in production of rigid-flex printed circuit boards. A rigid-flex printed circuit board comprises a substrate FR4. The production method includes the steps of cutting and drilling the substrate FR4, allowing a 0.1mm region to extend on one side at the position that filler blocks need to be made, and drilling the region to obtain a plurality of connections by which the filler blocks are connected with the substrate FR4; subjecting the substrate FR4 processed in the step A to punching, punching to obtain the filler blocks, and removing waste between the filler blocks and the substrate FR4, and back-pressing the substrate FR4 processed in the former step, and returning the filler blocks punched in the punching step into the substrate FR4. Production of the filler blocks is completed by single cutting, so that material cost and production process are decreased and production of the rigid-flex printed circuit boards is facilitated.

Description

technical field [0001] The invention relates to the field of processing rigid-flexible circuit boards, in particular to a method for manufacturing filling blocks in the process of manufacturing rigid-flexible circuit boards. Background technique [0002] With the development of mobile phones, communications and consumer electronics products, the demand for rigid-flex boards has increased sharply. At present, rigid-flex boards in the circuit board industry are generally made by ordinary filling methods. After material cutting, drilling and gong board, the outer frame for putting in the suitable filling block is made, and then the cutting, drilling and gong board are made to make a suitable filling block, and the above outer frame and filling block are stacked for use , in the above method, if the filling block that is cut directly for the first time is filled back for use, the gap will be too large to cause pits after the panel is pressed, and the production line in the subs...

AI Technical Summary

Problems solved by technology

[0002] With the development of mobile phones, communications and consumer electronics, the demand for rigid-flex boards has increased sharply. The filling method is produced. In this process, it is necessary to firstly cut, drill and gong the board according to the size of the filling block to make an outer frame for the suitable filling block, and then carry out the cutting, drilling and gong board to make a suitable In the above method, if the filling block directly under the first cut is filled back for use, the gap will be too large and there will be pits after the panels are pressed together. The post-process production lines will be poorly exposed, so the filler blocks that were dropped directly for the first time cannot be used. It is necessary to replace the filler blocks with a suitable size to prevent the flexible board from being concave due to the lack of suitable FR4 material at the rigid-flex joint during lamination. It brings difficulty to the etching process and sticking the protective film on the soft board surface, so the production process will undoubtedly increase the production cost of this process and cause unnecessary waste in the production process

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