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Ultraviolet laser processing device

A processing device, ultraviolet laser technology, applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that ordinary laser positioning cannot meet, difficult to meet product marking and cutting accuracy requirements, etc., to meet processing accuracy, The effect of precise marking and cutting

Active Publication Date: 2013-06-05
SHENZHEN HYMSON LASER INTELLIGENT EQUIP CO LTD
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Problems solved by technology

[0003] With the advancement of science and technology, the diameter of the focused spot of the ultraviolet laser can reach 0.005MM, and the processing accuracy is greatly improved. However, the traditional laser positioning method (manual or machine fixture positioning accuracy of 0.05MM and above) is difficult to meet the marking and cutting of products. Accuracy requirements, for example, in the processing of non-metal deburring, the accuracy requirements are within 0.03MM, so the positioning of ordinary lasers cannot meet

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  • Ultraviolet laser processing device

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Embodiment Construction

[0011] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] Such as figure 1 , the ultraviolet laser processing device of the present invention comprises ultraviolet laser device 1, vibrating mirror system, focusing lens 7, is also provided with splitter 4 on the optical path between ultraviolet laser device 1 and vibrating mirror X5, is also provided with splitter sheet 4 top There is a coaxial vision system 3, and the coaxial light source 9 in the coaxial vision system 3 is set on one side of the workpiece 8;

[0013] The ultraviolet laser beam emitted by the ultraviolet laser 1 is horizontally incident on the beam splitter 4, passes through the transmission of the beam splitter 4, then undergoes total reflection of the vibrating mirror system, and finally refracts through the focusing lens 7 to converge the ultraviolet laser beam to the workpiece 8. Realize accurate marking and cutting o...

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Abstract

The invention discloses an ultraviolet laser processing device which comprises an ultraviolet laser, a galvanometer system and a focusing lens. A beam split sheet is arranged on a light path between the ultraviolet laser and a galvanometer X, a coaxial visual system is further arranged above the beam split sheet, and a coaxial power source is arranged on one side of workpieces to be processed; ultraviolet laser beams emitted by the ultraviolet laser are horizontally emitted to the beam split sheet, transmitted by the beam split sheet, totally reflected by the galvanometer system, refracted by the focusing lens, and finally gathered to the workpieces to be processed; and light emitted by the light source is projected to the workpieces to be processed, then sequentially refracted by the focusing lens, and totally reflected by the galvanometer system to form parallel light, then the parallel light is emitted to the beam split sheet, totally reflected by the beam split sheet and finally captured and imaged by the coaxial visual system, and an industrial control computer regulates a deviation angle of the galvanometer X and a galvanometer Y in the galvanometer system according to imaging data. The ultraviolet laser processing device is high in processing accuracy and capable of accurately marking and cutting the workpieces to be processed.

Description

[technical field] [0001] The invention relates to the technical field of laser processing, in particular to an ultraviolet laser processing device. [Background technique] [0002] Laser micromachining refers to the process of product processing (marking, cutting) with a size of several to more than 1,000 microns. It is a branch of laser processing and has been widely used in various industries. It mainly uses high energy density The laser beam directly ablates, carbonizes, and engraves the material. The surface of the material absorbs the energy of the laser and then carbonizes, melts, and gasifies to achieve the purpose of processing. The main features are high laser energy, high efficiency, good effect, and low cost. Environmental protection and other advantages. [0003] With the advancement of science and technology, the diameter of the focused spot of the ultraviolet laser can reach 0.005MM, and the processing accuracy is greatly improved. However, the traditional lase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/06B23K26/42B23K26/03B23K26/04B23K26/064
Inventor 赵盛宇张松岭郭卫军曾林波钟辉
Owner SHENZHEN HYMSON LASER INTELLIGENT EQUIP CO LTD
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