Permeation barrier for encapsulation of devices and substrates

Abstract

A permeation barrier film structure for organic electronic devices includes one or more bilayers having a hybrid permeation barrier composition. Each of the one or more bilayers includes a first region having a first composition corresponding to a first CF4-O2 Plasma Reactive Ion Etch Rate and a second region having a second composition corresponding to a second CF4-O2 Plasma Reactive Ion Etch Rate, wherein the second Etch Rate is greater than the first Etch Rate by a factor greater than 1.2 and the hybrid permeation barrier film is a homogeneous mixture of a polymeric material and a non- polymeric material, wherein the mixture is created from a single precursor material.

Description

technical field [0001] The present invention generally relates to permeation barrier coatings for electronic devices. Background technique [0002] Organic electronic devices, such as organic light emitting devices (OLEDs), are prone to degradation when exposed to water vapor or oxygen. Protective barrier coatings on OLEDs to reduce exposure to water vapor or oxygen can help improve device lifetime and performance. Silicon oxide, silicon nitride or aluminum oxide films have been successfully used in food packaging, which have been considered as barrier coatings for OLEDs. However, these inorganic films tend to contain microscopic defects that allow some diffusion of water vapor and oxygen into the film. In some cases, defects manifest themselves as cracks in brittle films. While this level of water and oxygen diffusion is acceptable for food, it is not acceptable for OLEDs. To address these issues, multilayer barrier coatings using alternating inorganic and polymer layer...

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Problems solved by technology

But these multi-layer coatings have the disadvantage of complexity and cost

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