Laser machining device and laser machining control device

A laser processing and control device technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as complex structure of the device

Active Publication Date: 2013-06-12
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to avoid this, it is necessary to arrange the strip sensor in a ring shape so as to surround the optical axis of the incident laser light, and the device structure becomes complicated.

Method used

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  • Laser machining device and laser machining control device
  • Laser machining device and laser machining control device
  • Laser machining device and laser machining control device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0017] figure 1 It is a figure which shows the structure of the laser processing apparatus concerning Embodiment 1. The laser processing apparatus 100 is, for example, an apparatus for cutting an object W (a plate-shaped member, etc.) using laser light, and includes a laser oscillator 4, a transmission fiber 2, a processing head 3, and a control device 1.

[0018] The laser oscillator 4 oscillates laser light L (for example, a solid-state laser) capable of optical fiber transmission, and transmits it to the transmission optical fiber 2. One end of the transmission fiber 2 is connected to the laser oscillator 4 and the other end is connected to the processing head 3. The transmission fiber 2 transmits the laser light L from the laser oscillator 4 to the processing head 3 and transmits the reflected light Re reflected by the object to be processed W to the laser oscillator 4 side.

[0019] The processing head 3 irradiates the object W with the laser light L transmitted through the t...

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PUM

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Abstract

The present invention is provided with: a transmission fiber (2) that fiber-transmits laser light (L) radiated from a laser oscillator (4); a machining head (3) that radiates the laser light(L) sent from the transmission fiber (2) to the primary surface of a workpiece (W) in the perpendicular direction, and sends reflected light (Re) reflected in the direction coaxial to the laser light (L) by the workpiece (W) to the transmission fiber (2); a reflected light monitoring unit (10) that detects the amount of the reflected light (Re) sent from the transmission fiber (2); and a control device (1) that controls the laser oscillator (4) and the machining head (3). The control device (1) has a determination unit that, at the start of laser machining and on the basis of the amount of reflected light, determines whether or not the workpiece (W) meets laser machining conditions.

Description

Technical field [0001] The invention relates to a laser processing device and a laser processing control device for reducing processing defects. Background technique [0002] At present, in the case of processing with a laser processing device, the selection of processing conditions and the setting of the processing object (workpiece) based on commands from the NC (Numerical Control) device are performed independently, so there is no difference between the two. There is a correlation. As a result, processing is performed even if the processing conditions do not match the object to be processed, and as a result, processing defects may occur. [0003] As a method of determining whether a desired object to be processed is installed, there is a method of disposing a reflected light detection sensor on the object to be processed, and measuring the reflected light using the reflected light detection sensor. For example, when laser light is incident obliquely with respect to the surface...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B23K26/00B23K26/08B23K26/38B23K26/382B23K26/60B23K26/70
CPCB23K26/38B23K26/03B23K26/032B23K26/0665
Inventor宫本直树熊本健二西田聪腰前利树木野裕司黑川裕章
OwnerMITSUBISHI ELECTRIC CORP