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Laser cutting device and strip cutting machine with the device

A laser cutting and laser technology, applied in laser welding equipment, manufacturing tools, welding equipment, etc., can solve problems such as poor polarizing film, increased relative moving speed, and inability to cut, and achieve the effect of suppressing the deterioration of the quality of the cutting surface

Active Publication Date: 2016-01-20
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, if the above-mentioned conventional polarizing film cutting method using a laser is used, there is a problem that a problem occurs when cutting a polarizing film that moves relatively.
That is, when using the low output power side of the laser, there is a problem that proper cutting cannot be performed because the output power of the laser is unstable.
However, the problem with this technology is that it is necessary to increase the relative moving speed between the workpiece and the laser, and it is difficult to apply it to the case where the relative speed is small.

Method used

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  • Laser cutting device and strip cutting machine with the device
  • Laser cutting device and strip cutting machine with the device
  • Laser cutting device and strip cutting machine with the device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] use image 3 The strip cutter 20 cuts the polarizing film. The structure of the polarizing film 6 is that, in the order close to the condenser lens 5 of the laser cutting device 10, a PET film (38 μm), an adhesive layer (22 μm, the adhesive layer is peeled off together with the protective layer), a TAC film (80 μm ), a polyvinyl alcohol film (30 μm) and a COP (cycloolefin polymer) film (70 μm) as a protective film, and a PET film (38 μm) was laminated on the COP film via an adhesive layer as a separator.

[0064] First, the polarizing film 6 is accelerated to 50 m / s after 5 seconds from the stationary state of the polarizing film 6 by the rotation device of the unwinding part 11 and the winding part 13a. While accelerating to 50 m / s, cutting of the polarizing film 6 was implemented on the following conditions.

[0065] Laser oscillator: CO 2 laser

[0066] Output power of laser oscillator: above 20W and below 280W

[0067] Laser wavelength: 9.4μm

[0068] Laser fr...

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PUM

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Abstract

This laser cutter (10) is a device for cutting a polarizing film (6) by applying a laser beam (L6) thereto. The laser cutter (10) is provided with: a laser beam oscillator (1) for oscillating a laser beam (L1); a bend mirror (3) for reflecting the laser beam, which is oscillated by the laser beam oscillator (1), to the polarizing film (6); and a condenser lens (5) disposed between the polarizing film (6) and the bend mirror (3) and condensing a laser beam (L6). A beam splitter (4) through which the laser beam (L3) is transmitted and by which the laser beam (L3) is reflected is provided between the bend mirror (3) and the condenser lens (5).

Description

technical field [0001] The invention relates to a laser cutting device and a strip cutting machine with the device. Background technique [0002] Polarizing films are widely used in liquid crystal panels and the like. Conventionally, half-cutting of a polarizing film in which only the polarizing film in a laminate including a polarizing film is cut, edge cutting of a polarizing film, and the like have been performed in a processing step of a polarizing film. The cutting of the polarizing film is performed with a knife, but it is difficult to generate foreign matter such as film scraps from the cut object. Yield decreases due to such foreign matter being mixed into the polarizing film. [0003] In addition, in recent years, laser cutting is used for cutting. When cutting with a laser, compared with cutting with a knife, foreign matter such as film scraps is less likely to be generated from the object to be cut. Thereby, the fall of a yield can be suppressed. Therefore, s...

Claims

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Application Information

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IPC IPC(8): B23K26/062B23K26/067B23K26/38B23K26/00
CPCB23K26/0626B23K26/067B23K26/38
Inventor 植田幸治岸崎和范
Owner SUMITOMO CHEM CO LTD
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