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Through-hole capacitor and manufacturing method thereof

A manufacturing method and through-hole technology, applied in the direction of fixed capacitor electrodes and components of fixed capacitors, etc., can solve the problem of small capacitance, and achieve the effects of increasing contact area, increasing capacitance, and improving voltage regulation.

Inactive Publication Date: 2013-06-26
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Although the through-hole capacitor mentioned in the above patent can save the circuit board area, its capacitance is not large, especially as the number of ICs stacked on the substrate increases, some ICs may require a large instantaneous current. Capacitance capacitors to stabilize the voltage and current across the device

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  • Through-hole capacitor and manufacturing method thereof
  • Through-hole capacitor and manufacturing method thereof
  • Through-hole capacitor and manufacturing method thereof

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Embodiment Construction

[0042] The invention will be more fully understood hereinafter with reference to the accompanying drawings, which show various embodiments of the invention. However, the invention may also be practiced in many different forms and should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of the various layers may be exaggerated for the sake of clarity.

[0043] figure 2 is a schematic cross-sectional view of a through-hole capacitor according to the first embodiment of the present invention.

[0044] Please refer to figure 2 The through-hole capacitor 20 of the first embodiment includes a substrate 200 , a positive electrode layer 202 , a dielectric layer 204 , a first negative electrode layer 206 and a second negative electrode layer 208 . The a...

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Abstract

The invention discloses a through-hole capacitor and a manufacturing method thereof. The through-hole capacitor at least comprises a substrate, a positive layer, a dielectric layer, a first negative layer and a second negative layer. The substrate is provided with a plurality of through holes, the positive layer covers the inner surface of at least one through hole, and the surface of the positive layer in the through hole is of a porous structure. The dielectric layer is positioned on the porous structure of the positive layer. The first negative layer covers the surface of the dielectric layer, the second negative layer covers the surface of the first negative layer, and the conductivity of the second negative layer is higher than that of the first negative layer. When the negative layer in the through hole serves for signal transmission, the through-hole capacitor of the structure can be used as an impedance matching structure.

Description

[0001] The present invention is a divisional application of the invention patent application with the application number 200710305450.1 and the invention name "through-hole capacitor and its manufacturing method" filed on December 28, 2007. technical field [0002] The present invention relates to a through hole capacitor and its manufacturing method, and in particular to a through hole capacitor capable of increasing capacitance and its manufacturing method. Background technique [0003] The traditional capacitors on the circuit board are mostly surface mounted device (SMD) components, and the configuration is mainly to fix the capacitor on the pad, and the pad is fixed on the circuit board. [0004] As the function of the IC becomes more complex, the number of external pins connected to other components also increases, making the wiring work of the circuit board more and more complicated, and the installation of SMD capacitors also occupies the surface area of ​​the IC subs...

Claims

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Application Information

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IPC IPC(8): H01G4/005H01G4/008
Inventor 吴邦豪蔡丽端李明林郑丞良
Owner IND TECH RES INST
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