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A technology for parts and main parts, applied in the direction of contact parts, etc., can solve the problems of easy and fast corrosion, loss, expensive precious metals, etc., and achieve the effect of inhibiting corrosion

Inactive Publication Date: 2013-06-26
JST MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The above-mentioned precious metals are expensive, so it is required to thin the plating layer on the surface layer of the parts made of this metal, and set the thickness of the plating layer to be very thin.
However, if the thickness of the plating layer on the surface layer made of precious metals becomes thinner, small pores called pinholes are likely to be formed.
When pinholes are generated, there is a problem that the plating layer of the base exposed from the pinholes or the metal of the base material tends to corrode quickly due to electrolytic corrosion (galvanic corrosion)
However, in the environment where the parts are used for a long time, the sealing agent may be slowly lost
Therefore, there is a problem that it is difficult to suppress corrosion in a stable state for a long time

Method used

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Embodiment Construction

[0045] Hereinafter, modes for implementing the present invention will be described with reference to the drawings. In the description of this embodiment, the case where the present invention is applied to an electronic component constituting a terminal for a connector is taken as an example, but the present invention is not limited to this example, and the present invention can also be applied to other cases other than this example. invention. The present invention can be widely applied to components having a main body formed of a metal material and having a plated layer formed on the surface. That is, the present invention can be applied to electronic components other than terminals, and the present invention can also be applied to metal components other than electronic components.

[0046] figure 1 It is a cross-sectional view showing a state where the connector terminal 1 configured as a component in the present embodiment is attached to the connector 100 . The connector...

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Abstract

The invention provides a component which can set the thickness of cladding layer exposed to a surface of an external part to be thinner and restrains corrosion of the plating layer and a base metal for a long time in a stable state. The component (1) possesses a main body part (11) formed by metal materials; a bottom cladding layer (12) comprising an Ni cladding layer and covering the surface of the main body part (11); a multi-pore cladding layer (13) covered by the bottom cladding layer (12); and a surface cladding layer (14) formed on the surface of the multi-pore cladding layer (13) and exposed to the external part. The multi-pore cladding layer (13) is configured to be a multi-pore plasmid with a multi-pore structure (13a). The surface cladding layer (14) is configured to make the multi-pore structure (13a) dispersed on the surface of the multi-pore cladding layer (13) expose to the external part. The ionization tendency of the metal forming the surface cladding layer (14) is smaller than the ionization tendency of the metal forming the multi-pore cladding layer (13).

Description

technical field [0001] The present invention relates to a metal member having a plated layer formed on the surface. Background technique [0002] For parts made of metal materials, in order to suppress corrosion, it is usually achieved by forming a plating layer on the surface. In particular, components that can be used in harsh environments from the perspective of corrosion often have a plating layer formed on the exposed surface. The plating layer is composed of a noble metal with good corrosion resistance such as gold, silver, gold alloy, silver alloy, etc. . [0003] The above-mentioned precious metals are expensive, and therefore it is required to reduce the thickness of the plating layer on the surface layer of components made of the metal, and to set the thickness of the plating layer to be very thin. However, when the thickness of the plating layer on the surface layer made of noble metal becomes thin, small pores called pinholes are likely to be formed. When pinh...

Claims

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Application Information

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IPC IPC(8): H01R13/03
Inventor 雨宫直人赤田智
Owner JST MFG CO LTD
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