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Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring

A technology of resin composition and cured film, applied in the direction of plastic/resin/wax insulator, anti-corrosion coating, polyurea/polyurethane coating, etc., can solve the problems of complicated process and high cost, and achieve excellent light transmission and corrosion inhibition effect

Inactive Publication Date: 2017-08-29
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, patterning by photolithography has the problem of not only complicated process but also high cost

Method used

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  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring
  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring
  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring

Examples

Experimental program
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Effect test

preparation example Construction

[0142] The method for preparing the composition of the present invention is not particularly limited. As an example, the method of dissolving a (meth)acrylate polymer in a solvent, mixing an ion-trapping agent in this solution in a predetermined ratio, and making it a uniform solution is mentioned. Moreover, the manufacturing method of mixing a radical polymerization initiator, a silane coupling agent, a polymerization inhibitor, other additives etc. as needed in the appropriate stage of this manufacturing method is mentioned.

[0143] Moreover, when preparing the composition of this invention, the solution containing the (meth)acrylate polymer obtained by the polymerization reaction in a solvent can be used as it is. In this case, in the same manner as above, an ion-scavenging agent or the like may be added to the solution containing the (meth)acrylate polymer to obtain a uniform solution. In addition, a solvent may be further added for the purpose of concentration adjustmen...

Embodiment

[0156]Hereinafter, the present invention will be described in more detail with reference to synthesis examples, examples, and comparative examples, but the present invention is not limited to the following examples. It should be noted that the Mw of the copolymer obtained in the synthesis example was eluted using a Showa Denko GPC apparatus (Shodex GPC-101, columns: Shodex (registered trademark) KF803L and KF804L (manufactured by Showa Denko Co., Ltd.)). The solvent tetrahydrofuran was flowed into the column (column temperature: 40° C.) at a flow rate of 1 mL / min and measured under the condition that it was dissolved. Mw is represented by the polystyrene conversion value.

[0157] In addition, the abbreviations of the reagents used and the devices used are as follows.

[0158] · DEGMEA (diethylene glycol monoethyl ether acetate), MMA (methyl methacrylate), MAA (methacrylic acid), ST (styrene), EMA (ethyl methacrylate): Tokyo Chemical Industry ( Co., Ltd.

[0159] ・MAIB: Dim...

Synthetic example 1

[0169] 600.0 g of DEGMEA was placed in a 1,000 mL four-necked flask, and a mixed solution of 392.1 g of EMA and 7.9 g of MAIB was slowly added dropwise thereto over 2 hours while stirring at 70° C. (internal temperature) under a nitrogen atmosphere. After dropping, it was made to react at 70 degreeC for 20 hours, and the polymer solution P1 was obtained. Mw = about 50,000.

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Abstract

The present invention provides a resin composition for cured film formation, the resin composition comprising a (meth)acrylate polymer (except those having a silane structure in a side chain or a carboxylic acid group in a side chain), an ion trap agent, and a solvent.

Description

technical field [0001] The present invention relates to a method for inhibiting corrosion of a resin composition for forming a cured film, a cured film, a conductive member, and metal electrodes and / or metal wiring. Background technique [0002] Conventionally, protective films, insulating films, and the like required for touch panels and the like have been formed at desired locations by patterning using photolithography using a photosensitive resin composition (for example, refer to Patent Document 1). However, patterning by photolithography has a problem of not only complicated steps but also high cost. Therefore, there is a demand for a composition capable of forming a protective film, an insulating film, and the like at necessary locations using a more simple method and at low cost. [0003] In addition, in recent years, metal-based materials such as silver, copper, and molybdenum have been proposed as substitutes for conventional transparent conductive materials made o...

Claims

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Application Information

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IPC IPC(8): C09D133/06C08F2/44C08L33/06C09D5/08C09D7/12C09D175/14H01B3/44
CPCC08F2/44C08L33/06C09D5/08C09D133/06C09D175/14C09D7/40H01B3/44C08K5/3472C08L33/08C09D133/08C09D133/10C09D7/20
Inventor 服部隼人山田智久古贺春香
Owner NISSAN CHEM IND LTD
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