Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring

A technology of resin composition and cured film, applied in the direction of plastic/resin/wax insulator, anti-corrosion coating, polyurea/polyurethane coating, etc., can solve the problems of complicated process and high cost, and achieve excellent light transmission and corrosion inhibition effect

Inactive Publication Date: 2017-08-29
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, patterning by photolithography has the probl

Method used

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  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring
  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring
  • Resin composition for cured film formation, cured film, electrically conductive member, and corrosion inhibition method for metal electrode and/or metal wiring

Examples

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Example Embodiment

[0142] The preparation method of the composition of the present invention is not particularly limited. As an example, a method of dissolving a (meth)acrylate polymer in a solvent and mixing an ion trapping agent in the solution at a predetermined ratio to prepare a uniform solution can be cited. In addition, a production method in which a radical polymerization initiator, a silane coupling agent, a polymerization inhibitor, other additives, and the like are mixed as necessary at an appropriate stage of the production method can be cited.

[0143] In addition, when preparing the composition of the present invention, a solution containing a (meth)acrylate polymer obtained by a polymerization reaction in a solvent can be used as it is. In this case, in the same manner as described above, an ion trapping agent or the like can be added to the solution containing the (meth)acrylate polymer to form a uniform solution. In addition, for the purpose of concentration adjustment, a solvent ...

Example Embodiment

[0155] Example

[0156] Hereinafter, synthesis examples, examples, and comparative examples are given to illustrate the present invention in more detail, but the present invention is not limited to the following examples. It should be noted that the Mw of the copolymer obtained in the synthesis example used Showa Denko Co., Ltd. GPC equipment (Shodex GPC-101, column: Shodex (registered trademark) KF803L and KF804L (Showa Denko Co., Ltd.)). The solvent tetrahydrofuran was flowed into the column (column temperature 40°C) at a flow rate of 1 mL / min to be measured under the conditions of dissolution. Mw is expressed as a polystyrene conversion value.

[0157] In addition, the abbreviations of the reagents used and the devices used are as follows.

[0158] ·DEGMEA (diethylene glycol monoethyl ether acetate), MMA (methyl methacrylate), MAA (methacrylic acid), ST (styrene), EMA (ethyl methacrylate): Tokyo Chemical Industry ( Co., Ltd. Manufacturing

[0159] ·MAIB: 2,2'-Dimethyl azobis(iso...

Example Embodiment

[0168] [Synthesis Example 1]

[0169] A 1,000 mL four-necked flask was charged with 600.0 g of DEGMEA, and a mixed solution of 392.1 g of EMA and 7.9 g of MAIB was slowly dropped therein while stirring under a nitrogen atmosphere at 70°C (internal temperature) over 2 hours. After dripping, it was made to react at 70 degreeC for 20 hours, and the polymer solution P1 was obtained. Mw = about 50,000.

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Abstract

The present invention provides a resin composition for cured film formation, the resin composition comprising a (meth)acrylate polymer (except those having a silane structure in a side chain or a carboxylic acid group in a side chain), an ion trap agent, and a solvent.

Description

technical field [0001] The present invention relates to a method for inhibiting corrosion of a resin composition for forming a cured film, a cured film, a conductive member, and metal electrodes and / or metal wiring. Background technique [0002] Conventionally, protective films, insulating films, and the like required for touch panels and the like have been formed at desired locations by patterning using photolithography using a photosensitive resin composition (for example, refer to Patent Document 1). However, patterning by photolithography has a problem of not only complicated steps but also high cost. Therefore, there is a demand for a composition capable of forming a protective film, an insulating film, and the like at necessary locations using a more simple method and at low cost. [0003] In addition, in recent years, metal-based materials such as silver, copper, and molybdenum have been proposed as substitutes for conventional transparent conductive materials made o...

Claims

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Application Information

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IPC IPC(8): C09D133/06C08F2/44C08L33/06C09D5/08C09D7/12C09D175/14H01B3/44
CPCC08F2/44C08L33/06C09D5/08C09D133/06C09D175/14C09D7/40H01B3/44C08K5/3472C08L33/08C09D133/08C09D133/10C09D7/20
Inventor 服部隼人山田智久古贺春香
Owner NISSAN CHEM IND LTD
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