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A hybrid preparation process for a three-dimensional mask plate

A three-dimensional, preparation process technology, applied in printing plate preparation, printing, assembling printed circuits with electrical components, etc., to achieve the effect of smooth and uniform layout, improved hole wall quality, and improved interface bonding force

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to transfer an accurate amount of material to the PCB surface with a planar template, and the combination of planar templates through experiments also cannot meet its requirements.

Method used

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  • A hybrid preparation process for a three-dimensional mask plate
  • A hybrid preparation process for a three-dimensional mask plate
  • A hybrid preparation process for a three-dimensional mask plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] In an embodiment of the present invention, the preferred process steps in electroforming the first electroforming layer are as follows:

[0113] (1) Mandrel pretreatment: select 1.8mm thick 304 stainless steel plate as the mandrel material, cut the mandrel into a size of 800mm*600mm, and then degrease, pickle and sandblast the mandrel, and the degreasing time 2min, pickling time 1min, sandblasting time 3.5min, sandblasting particle size 1-10μm, sandblasting pressure 2psi;

[0114] (2) Film 1: Apply film to the surface of the mandrel;

[0115] (3) Exposure 1: Expose the pattern opening area and the part other than the alignment hole area, so that the unexposed area can be removed by development, and the exposed part is left as a protective film for the subsequent electroforming step. The exposure amount is 1500mJ, and the exposure time 1200s;

[0116] (4) Single-sided development 1: Clean off the dry film of the developed part except the pattern opening area and the al...

Embodiment 2

[0120] According to the (5) electroforming step in Example 1, preferably, the electroforming process parameters used are as follows:

[0121] Current density (A / m 2 ) 2.3

[0122] Electroforming time 1(min) 150

[0123] Temperature (℃) 50±1

[0124] pH 4-4.5

[0125] Activation time 1 (min) 3

[0126] Electroforming solution composition:

[0127] Nickel sulfamate (g / L) 60

[0128] Nickel chloride heptahydrate (g / L) 14

[0129] Boric acid (g / L) 35

[0130] Brightener (ml / L) 2.1

[0131] Stabilizer (ml / L) 3

[0132] Wetting agent (ml / L) 2

Embodiment 3

[0134] In an embodiment of the present invention, a preferred process step of electroforming the protrusion of the printing surface is as follows:

[0135] (1) Pretreatment: pickling and sandblasting the mask plate prepared in step A, wherein the pickling time is 2 minutes, the sandblasting time is 5 minutes, the sandblasting particle size is 1-10 μm, and the sandblasting pressure is 5 psi;

[0136] (2) Reverse film 2: the printed surface film of the electroformed layer prepared in step A;

[0137] (3) Alignment: CCD alignment is performed through the alignment hole of the electroforming layer to determine the origin of the coordinates;

[0138] (4) Exposure 2: The exposure area is other than the three-dimensional area (convex area), the exposure amount is 2000mJ, and the exposure time is 2500s;

[0139] (5) Single-sided development 2: Clean and remove the film on the unexposed part, keep the film on the exposed part, and the developing time is 360s;

[0140] (6) Electroform...

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Abstract

The present invention discloses a hybrid production process for a three-dimensional mask plate. The process comprises steps of: electroforming a first electroformed layer: core mold pretreatment -> film mounting 1a-> exposure 1 -> single sided developing 1 -> electroforming 1 -> film mounting 1b -> exposure 2 -> stripping; electroforming a protruding part on the printing surface: pre-treatment -> reverse side film mounting 2 -> position alignment-> exposure 3 -> single sided developing 2 -> electroforming 2 -> stripping; and laser cutting pattern openings on the concave area of a PCB surface and on a three-dimensional structure. By adopting the mask plate produced by the hybrid production process provided in the invention, not only precise positioning of a convex area part on the mask plate is enabled, but also the surface quality of the mask plate and the uniformity of coating layer thickness are ensured through optimized electroforming process parameters; mean while, by employing a laser cutting process to perform cutting processing to the concave three-dimensional part of the mask plate and the pattern opening of this part, the processing rate of the plate surface can be greatly improved, thus reducing processing costs.

Description

[0001] technical field [0002] The invention relates to a manufacturing process of a mask, which belongs to the field of material preparation and processing, and in particular to a manufacturing process of a three-dimensional metal mask used for coating solder on a printed circuit. [0003] Background technique [0004] Surface Mount Technology (SMT for short) was born in the 1960s. That is to use certain tools to accurately place the non-lead surface mount components on the PCB pads that have been printed with solder paste or glued, and then undergo wave or reflow soldering to establish a good mechanical relationship between the components and the circuit board. and electrical connection. [0005] The development of the PCB industry is not limited to flat templates, but also includes some printed boards with specific shape requirements to meet the requirements of soldering larger components on the PCB without affecting the overall printing effect. The combination of tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/14H05K3/34
Inventor 魏志凌高小平潘世珎王峰
Owner KUN SHAN POWER STENCIL
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