Three-dimensional mask plate with graphic openings and for printing

Abstract

The invention discloses a three-dimensional mask plate with graphic openings and for printing. The three-dimensional mask plate with the graphic openings and for printing comprises a substrate, a printing face and a PCB (Printed circuit board) face, wherein the printing face and the PCB face are located on two sides of the substrate; the mask plate is provided with multiple graphic openings and a three-dimensional structure; the three-dimensional structure comprises a raised area on the printing face and a hollow area on the PCB face; the graphic openings meeting printing requirements are formed in the three-dimensional structure; the mask plate is provided with a three-dimensional raised and hollow part of which the raised height is 0.1-10mm and the hollow depth is 0.1-10mm; an external included angle between the raised and hollow part and the plate face is 80-90 degrees; and the components of the mask plate are 40% to 55% of iron and 45% to 60% of nickel. The precision of the mask plate is very high; the evenness is high and the plate face is good in quality, shining and free of coarse points, scratches and pin holes; the openings are good in quality and the hole walls are smooth and bur-free; and the mask plate is low in production cost, simple in technology and low in energy consumption.

Description

technical field [0001] The invention relates to a three-dimensional mask, in particular to a three-dimensional mask for printing with graphic openings. Background technique [0002] With the rapid development of my country's electronics industry, stencil printing technology has also been applied in the electronics manufacturing industry, and SMT printing is a typical example. In the manufacturing process of electronic products, soldering electronic components and PCB needs to put tin on the PCB first, and there are hundreds of pads on the PCB that need to be tinned. The position of each pad corresponds to the electronic component. The best way to accurately tin the pads that need to be tinned at one time is to print. The usual method used in the electronics manufacturing industry is to make a stainless steel sheet with numerous small holes, each hole corresponds to a pad that needs to be tinned, and then paste the stainless steel sheet on the stretched mesh, and the mesh is...

AI Technical Summary

Problems solved by technology

However, the opening precision of the steel mold made by the traditional technology through laser cutting technology cannot meet the requirements, and the quality of the board surface is not high enough.

However, the electroformed nickel mask is easy to form pinholes and rough spots on the surface of the plate, and the solution is unstable, high cost, and high energy consumption.

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