Method for exposure compensation and correction

A compensation method and editing technology, which is applied in the direction of microlithography exposure equipment, photolithography exposure equipment, etc., can solve the problems that product quality and fineness are difficult to be guaranteed.

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Claims
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Problems solved by technology

[0009] However, neither of the above two methods is a compensation on the document, and it is difficult to guarantee the quality and fineness of the product

Method used

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  • Method for exposure compensation and correction

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] Please refer to figure 1 As shown, the exposure correction and compensation method of the present invention includes the following steps:

[0030] S10: Editing test files and setting partitions

[0031] Set the partition, and edit the same type of IC openings in the partition, the number is N; because the IC opening requirements in different areas are different, including shape and size, so mark the different partitions with characters for marking and distinguishing; for different partitions Record the X and Y direction dimensions of the IC opening X 1 , Y 1 ;X 2 , Y 2 ;...X m , Y ...

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Abstract

The invention discloses a method for exposure compensation and correction, including: S10, editing a test file, and setting partitions; S11, performing exposure without any compensation and correction to a graphic file; S12, detecting a product according to partitions, and recording the sizes of the IC opening in each partition in the X and Y directions as X'1, Y'1; X'2, Y'2; ... X'm, Y'm; S13, calculating a scale; S14, analyzing data of X and Y directions, respectively fitting into corresponding relation formulas, and generating different types of IC opening compensation data X[compensation] and Y[compensation]; and S15: after determining the compensation data, applying on files and manufacturing products to verify reproducibility. The method for exposure compensation and correction of the present invention performs compensation on files, mainly plays the role of opening correction, and is more convenient, more economical, and more effective and feasible than general methods by using a compensation photomask or an exposure apparatus.

Description

[0001] technical field [0002] The invention belongs to the technical field of exposure of solar cell substrates, in particular to an exposure correction and compensation method. [0003] Background technique [0004] The exposure technology is to cover the substrate with a photoresist layer with photo-sensitive material, and then the parallel light emitted by the light source is irradiated onto the photoresist layer through the mask. Simply speaking, exposure means that parallel light passes through the mask so that the pattern on the mask is completely transferred to the photoresist layer. [0005] However, in the actual subsequent production process, during development, electroforming or etching, the graphics will be deformed due to factors such as liquid impact and temperature, resulting in deviations. Therefore, in order to obtain a qualified product size, this needs to be corrected. [0006] In the prior art, the correction method mainly includes: [0007] 1. S...

Claims

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Application Information

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IPC IPC(8): G03F7/20
Inventor 魏志凌高小平陈龙英莫松亭
Owner KUN SHAN POWER STENCIL
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