Light source module and preparation method thereof

Abstract

The invention relates to a light source module and a preparation method thereof. The light source module comprises a metal base plate, wherein a concave pit is formed in the top surface of the base plate; the lateral surface of the concave pit is a bowl-shaped reflecting surface; and an LED (Light Emitting Diode) crystal is arranged in the concave pit and is arranged on the bottom surface of the concave pit through an AuSn welding layer. The light source module further comprises fluorescent power layer blocks which are distributed in a discrete manner; and an optical layer is arranged at the top of a silica gel layer. The preparation method of the light source module comprises the following steps of S1, providing the metal base plate and processing the concave pit and a circuit layer; S2, arranging a bowl-shaped reflecting surface coating; S3, providing an AuSn soldering lug and arranging the AuSn soldering lug on the bottom surface of the concave pit; S4, providing the LED crystal and placing the LED crystal on the AuSn soldering lug; S5, carrying out eutectic welding; S6, welding a gold line; S7, sealing compound; S8, carrying out screen printing on the fluorescent power layer blocks; and S9, laminating the optical layer. The invention provides the light source module with simple structure and good heat radiating effect and the preparation method of the light source module.

Description

technical field [0001] The present invention relates to semiconductor lighting technology, and also to plane display technology, in particular to a light source module and a preparation method thereof. Background technique [0002] LED has the characteristics of long life and power saving, and is more and more widely used in the field of lighting or display. [0003] Chinese patent document CN201382335 disclosed a backlight on January 13, 2010, including at least one backplane, a frame, at least one PCB board and at least one LED light-emitting unit arranged on the PCB board, and a control device; the PCB board is also provided with At least one power supply positive line, one less power supply positive line, one less signal line, each LED light-emitting unit is connected by at least one signal line, one power supply positive line and one power supply negative line, and each LED light-emitting unit includes at least one set LED light-emitting diodes, the PCB board is fixedl...

AI Technical Summary

Problems solved by technology

[0005] The disadvantages of the existing technologies including the above patented technologies are: firstly, the structure is complicated and the cost is high; secondly, the heat dissipation effect of the light source is not good; Or in contact with air, it is easy to oxidize and the excitation efficiency is not high. Fourth, the existing technology does not actively use the side of the LED crystal to emit light, the light extraction efficiency is low, and the temperature of the light source module rises rapidly.

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