Cavity liquid tin target generator for laser plasma pole ultraviolet source

Abstract

The invention discloses a cavity liquid tin target generator for a laser plasma pole ultraviolet source. The cavity liquid tin target generator comprises a high pressure cavity body, an electric heater, a hot resistance, a shaking rod, an air source controller, a pressure transmitter, a nozzle, a cooling fan and a cooling water sleeve, wherein the electric heater is used for melting a solid state tin material in the cavity body into a liquid state tin material which is ejected from a cavity annular nozzle the two ends of which have pressure difference to form hollow liquid drops or hollow pillar-shaped liquid drop currents; the cavity annular nozzle contains the maximum atom number of EUV photon energy required by radiation, and the absorption efficiency is high; a compression system composed of the air source controller and the pressure transmitter is used for adding high pressure for a stock solution container; a target chamber is pumped and is filled with hydrogen or argon, and the EUV absorption and the damage of high-temperature high-pressure plasma on a collecting mirror are reduced. The cavity liquid tin target generator provided by the invention has the advantages that the ejecting distance is far, the laser absorption efficiency and EUV conversion efficiency are high, the system stability is good, the cost is cheap, and the cavity liquid tin target generator is more suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the technical field of laser extreme ultraviolet light sources, in particular to a cavity liquid tin target generator for laser plasma extreme ultraviolet light sources, mainly to provide a liquid tin target for extreme ultraviolet light sources with high conversion efficiency and low debris target. Background technique [0002] In the process of the development of electronic information industry, integrated circuit technology has played a very important role in the development of modern industry and people's life. The theme of the semiconductor manufacturing industry is to make the transistor as small as possible and integrate as many transistors as possible. With the continuous update of the chip technology, the chip technology has gradually shrunk from the initial 2μm chip technology to the current 22nm. 2μm and 22nm refer to the smallest scale that can be engraved by the chip process, and this scale is mainly determined b...

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Problems solved by technology

Although the solid target has a high density, it is easy to generate debris; a

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