Silicon-glass micro pressure sensor chip of island membrane self-packaging structure and manufacturing method

A pressure sensor, self-encapsulation technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, instruments, force measurement, etc., can solve the problem of increasing manufacturing costs, affecting the output characteristics and stability of pressure sensors, and expanding or shrinking silicone and other issues to achieve the effect of improving reliability

Active Publication Date: 2013-09-04
厦门纵能电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This solution not only increases the manufacturing cost, but also the temperature change will cause the expansion

Method used

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  • Silicon-glass micro pressure sensor chip of island membrane self-packaging structure and manufacturing method
  • Silicon-glass micro pressure sensor chip of island membrane self-packaging structure and manufacturing method
  • Silicon-glass micro pressure sensor chip of island membrane self-packaging structure and manufacturing method

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Embodiment Construction

[0052] The following embodiments will further illustrate the present invention in conjunction with the accompanying drawings.

[0053] see Figure 1~4 , the silicon-glass micro pressure sensor chip embodiment of the island membrane self-encapsulation structure of the present invention is provided with a pressure sensitive film 4 and a base 1 with a cavity 2; the pressure sensitive film 4 is a front island membrane composite structure, The stress-concentrated area of ​​the film composite structure is provided with four piezoresistors 6, and the four piezoresistors 6 form a Wheatstone bridge through metal electrodes, and the Wheatstone bridge is formed by using a silicon-glass anode bonding process. Sealed in an airtight absolute pressure chamber, the Wheatstone bridge connects the interface preset electrodes with external testing equipment through metal leads to form a complete pressure sensing and measuring system.

[0054] The pressure sensitive film 4 is provided with a raise...

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Abstract

The invention provides a silicon-glass micro pressure sensor chip of an island membrane self-packaging structure and a manufacturing method, and relates to a micro pressure sensor. The silicon-glass micro pressure sensor chip of the island membrane self-packaging structure and the manufacturing method are not only high in reliability but also suitable for severe environments of moist, acid-base, static electricity and the like. The silicon-glass micro pressure sensor chip of the island membrane self-packaging structure is provided with a pressure sensing membrane and a base provided with a cavity; the pressure sensing membrane is of an obverse side island membrane composite structure, four voltage dependent resistors are arranged in a concentration area with the maximum stress of the island membrane composite structure, the four voltage dependent resistors form a Wheatstone bridge through metal electrodes, a silicon-glass anodic bonding process is adopted to enable the Wheatstone bridge to be sealed in a sealed absolute pressure cavity, and the Wheatstone bridge enables an interface preset electrode to be connected with external testing equipment through metal leads to form a complete pressure sensitive and measuring system. The manufacturing method comprises the steps of technological manufacturing of an SOI wafer; manufacturing of a substrate part; bonding and follow-up processes.

Description

technical field [0001] The invention relates to a micro pressure sensor, in particular to a silicon-glass micro pressure sensor chip with an island membrane self-encapsulation structure and a manufacturing method. Background technique [0002] In various application fields of sensors, temperature, flow, pressure, and position are the most common test parameters. [0003] Among all kinds of sensors, because the pressure sensor can be widely used in the measurement and control of pressure, height, and liquid flow, flow velocity, liquid level, and pressure, it has become a type of sensor with the most mature sensor technology and stable performance ratio. According to the Japan Electric Measuring Instrument Industry Association's statistics on the production and sales of process sensors (temperature, flow, pressure, position, density, etc.), pressure sensors account for more than one-third of the entire process sensors, and their proportion is still high. Continue to increase,...

Claims

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Application Information

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IPC IPC(8): G01L1/20H01L41/22
Inventor 伞海生许辉明陈然斌余煜玺
Owner 厦门纵能电子科技有限公司
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