Energy-saving circulation micro-nano optoelectronic chip cooling device based on Stirling engine

Abstract

The invention aims at radiating problems of a high-density stacked micro-nano optoelectronic chip integrated component and uses a Stirling engine to establish a physical device achieving energy cyclic utilization, and particularly provides an energy-saving circulating type micro-nano optoelectronic chip radiating device based on the Stirling engine. The device comprises a chip integrated component, a fan, a radiator, a fluid container, a micropump, a chip cooling module, the minitype Stirling engine, supporting columns and a micropipe. According to the device, fluid / wind cooling is used, radiating efficiency of the high-density stacked micro-nano optoelectronic chip integrated component can be greatly improved, stability when the chip integrated component works normally is guaranteed, thermal energy generated by the chip integrated component is utilized, the Stirling engine is applied to convert the thermal energy into mechanical energy to drive the fan and the pump, and thus a radiating purpose is realized. The energy-saving circulating type micro-nano optoelectronic chip radiating device is energy-saving, environment-friendly, green and efficient, and has good radiating effects and low noise.

Description

technical field [0001] The invention relates to a heat dissipation device for integrated components of micro-nano optoelectronic chips, especially a liquid / air cooling device powered by a micro Stirling engine, which is suitable for cooling the integrated components of multi-layer stacked micro-nano optoelectronic chips in electronic equipment cool down. Background technique [0002] Stacked micro-nano optoelectronic chip integrated components have gradually become the mainstream of technological development in recent years. Stacked chips refer to two or more chips vertically stacked in the same package without changing the package size. It is characterized by multi-function. High performance, large capacity and high density, but heat dissipation has become the main factor restricting its development. Traditional chip cooling methods are mainly air-cooled and water-cooled. Liquid / air cooling devices are widely used on high-power motherboards. The Stirling engine is a kind...

AI Technical Summary

Problems solved by technology

[0003] So far, the patents for researching chip heat dissipation mainly include: CN02149603.X announced a heat-driven heat exchanger, which uses microtube liquid cooling to dissipate heat. The device is driven by the liquid itself, and lacks external power, which affects heat dissipation efficiency; A kind of CPU water-cooled heat sink is disclosed, and the structure of the cooling pipe is too simple, and the liquid cannot fully absorb the heat of the chip; CN01232219.9 has announced a kind of air-cooled fin heat sink, without recycling energy

Images