Photoelectric module performance test device and test method in high temperature environment
A technology for photoelectric modules and high-temperature environments, which is applied in the direction of measuring devices, lamp testing, and measuring electricity, and can solve problems such as reliability distortion
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2015-07-29
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to an experimental device in the field of accelerated life test, and specifically refers to a photoelectric module performance test device and a test method in a high-temperature environment. Background technique
[0002] The unified definition of the accelerated H life H test was first proposed by the Merrom Air Show Center in 1967. The accelerated life test is based on reasonable H engineering H and H statistical H assumptions, using statistical models related to H physical H failure laws A test method that converts information obtained in an accelerated environment beyond the normal stress level to obtain a reproducible numerical estimate of the characteristics of the product at the rated stress level. In short, the accelerated life test is a life test method that shortens the test period by increasing the test stress while keeping the failure mechanism unchanged. The accelerated life test adopts the accelerated stress level t...
Examples
Embodiment
[0061] like Figures 1 to 3As shown, the photoelectric module performance test device under the high temperature environment of the present invention, the photoelectric module performance test device under the high temperature environment, comprises a high temperature oven, an internal test board is installed in the high temperature oven, and an external test board, the internal test board and the external test board Connection, the output signal of the external test board is transmitted to the computer; the internal test board includes an SFP socket, the SDA, SCL, VCC three pins of the SFP socket are connected to the metal terminal, the SDA bus and the SCL bus are connected to the optical module to achieve reading communication, VCC Provide stable power. There are n SFP sockets, n is a natural number greater than 1, and the n SFP sockets are respectively connected to the I2C bus multiplexer and the analog multiplexer. The multiplexer adopts the ADG506AKR model, and the I2C b...