Processing method of device wafer with bump

Abstract

The invention provides a processing method of a device wafer with a bump. According to the invention, even the device wafer with the bump can be thinned and not damaged, and the devices will not be disqualified because of adhesion of the adhesive onto concave and convex parts formed by the bump. The processing method for a bump-included device wafer is characterized by including wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.

Description

technical field [0001] The present invention relates to a processing method of a semiconductor device wafer, and more specifically, relates to a technique for facilitating handling of a thinned semiconductor device wafer. Background technique [0002] In processing a wafer having a plurality of devices on its surface, such as a semiconductor device wafer or an optical device wafer, for example, backside grinding of the wafer is performed to reduce the thickness of the wafer to 50 μm or less. [0003] Handling (handling) of wafers having a thickness of 50 μm or less becomes very difficult compared with thicker wafers. Problems such as cracks occurring on the outer periphery of the wafer or a significant reduction in rigidity arise. [0004] Therefore, the following technology is known: in the state where the surface (device surface) of the wafer is attached to a carrier wafer (also referred to as a support wafer or a support plate) made of glass or silicon by using an adhesi...

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Problems solved by technology

[0006] However, a device wafer with bumps having a plurality of bumps formed on the surface of the semiconductor wafer has a problem that the adhesive enters the concavo-convex portions formed by the bumps, and after the device is peeled off from the carrier wafer, the intruded adhesive is removed. It is very difficult to completely remove the adhesive with fine unevenness

[0008] Therefore, when the wafer is held on the holding table and the back surface of the wafer is ground to make the wafer thinner, if the remaining area of ​​the outer periphery is not held from the lower side, the remaining area of ​​the outer periphery will be in a state of floating from the holding table, so there is a possibility of wafer damage.

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