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A new type of moisture-proof outdoor smdled

An outdoor and accommodating cavity technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of easy corrosion, increased cost, and low moisture-proof level

Active Publication Date: 2016-09-28
厦门市信达光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the SMDLED structure, water vapor still climbs up along the gap between the bracket 10 and the PIN pin 20, as figure 2 As shown, climb up along the direction of the arrow, it is easy to corrode the contact between the gold wire 40 and the positive PIN pin 20 and the negative PIN pin 20, resulting in poor contact, or even easy to fall off. Extra pressure safety wire 50 is used to compress the contact between the gold wire 40 and the PIN pin 20, the manufacturing process is complicated and the cost is increased
Therefore, the overall moisture-proof level of the SMDLED structure is relatively low, and the service life is relatively short

Method used

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  • A new type of moisture-proof outdoor smdled
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Embodiment Construction

[0033] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0034] refer to Figure 6 to Figure 9 As shown, a new type of moisture-proof outdoor SMD LED disclosed by the present invention includes a bracket 1 provided with an accommodating cavity 11 , a PIN pin 2 , a chip 3 and a gold wire 4 .

[0035] The bottom of the accommodating chamber 11 is hollowed out, and the PIN pins 2 are symmetrically embedded in the hollowed out place. One side is used as the positive PIN pin 2 and the other side is used as the negative PIN pin 2 . A layer of resin colloid 5 is arranged at the bottom of the accommodation cavity 11, and a circular chip accommodation through groove 12 and a circular gold wire accommodation through groove 14 are reserved, and the chip 3 is placed in the circular chip accommodation through groove 12. 3 Connect the positive PIN pin 2 and the negative PIN pin 2 respectively through the gold wir...

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Abstract

The invention discloses a novel damp-proof outdoor SMDLED (surface mount device light-emitting diode) comprising a support, pins, chips and gold threads. The support is provided with an accommodating cavity hollow out at the bottom, the pins are symmetrically embedded at the hollow-out position, pins on one side serve as positive pins and pins on the other side serve as negative pins; a PPA (phenyl-propanolamine) colloid layer is arranged at the bottom of the accommodating cavity, and reserved to form circular chip-accommodating through grooves and circular gold-thread-accommodating through grooves; the chips are disposed in the circular chip-accommodating through grooves and are respectively connected with the positive pins and the negative pins through the gold threads, and connecting ends of the gold threads and the positive and negative pins are disposed in the circular gold-thread-accommodating through grooves. According to the arrangement, the gold threads contact well with the pins without being pressed by security threads, so that manufacturing process is simple with a simplified structure, and cost is saved. Meanwhile, the colloid is encapsulated in the gold-thread-accommodating through grooves to prevent water vapor from rising along the pins to contact with the gold threads, so that damp-proof function is further performed, and service life is prolonged.

Description

technical field [0001] The invention relates to an LED, in particular to a novel moisture-proof outdoor SMD LED. Background technique [0002] Such as Figure 1 to Figure 4 A disclosed SMD LED structure includes a bracket 10 provided with an accommodating cavity 101, a PIN pin 20, a chip 30, a gold wire 40 and a security wire 50; as Figure 4 As shown, the bottom of the accommodating cavity 101 is hollowed out, and the PIN pins 20 are symmetrically embedded in the hollowed out place, one side is used as the positive PIN pin 20, and the other side is used as the negative PIN pin 20, and the PIN pin 20 extends into the accommodating cavity 101; figure 2 As shown, the chip 30 is installed on the PIN pin 20, and is respectively connected to the positive PIN pin 20 and the negative PIN pin 20 arranged symmetrically through the gold wire 40. [0003] In the SMDLED structure, water vapor still climbs up along the gap between the bracket 10 and the PIN pin 20, as figure 2 As sho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54
Inventor 谭亮
Owner 厦门市信达光电科技有限公司