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Cutting method

A cutting method and cutting edge technology, which is applied in the direction of electrical components, fine working devices, working accessories, etc., can solve the problem that the finished thickness of the processed object cannot be controlled with high precision, and achieve the effect of preventing thermal expansion

Inactive Publication Date: 2013-09-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In addition, there is a problem that the finished thickness of the workpiece cannot be controlled with high precision when the height position detector thermally expands due to the heat generated by the operation of the device and the temperature change of the room temperature, etc.

Method used

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Embodiment Construction

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , shows a perspective view of a cutting device 2 suitable for implementing the cutting method of the present invention. The housing 4 of the cutting device 2 is composed of a horizontal housing part 6 and a vertical housing part 8 .

[0028] A pair of guide rails 12 , 14 extending in the vertical direction are fixed to the vertical housing portion 8 . A cutting tool (cutting tool) cutting unit 16 is mounted so as to be movable in an up-down direction along the pair of guide rails 12 , 14 . The tool cutting unit 16 is attached to a moving base 18 that moves vertically along a pair of guide rails 12 and 14 via a support portion 20 .

[0029] The tool cutting unit 16 includes: a headstock 22 mounted to the support portion 20 ; a spindle 24 rotatably accommodated in the headstock 22 ; and a servo motor 26 for rotationally driving the spindle 24 ...

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Abstract

The present invention provides a cutting method, which can control the finished thickness of an object to be processed with high precision. The cutting method uses a cutter cutting component with a cutting blade to cut the object to be processed, and is characterized by including: a holding step, in which the object to be processed is held by a chuck table; a step of calculating the thickness of the object to be processed, in which, after the holding step is implemented, a height position detection component with a contact pin is used for detecting the height position of a holding surface of the chuck table and the height position of the upper surface of the object to be processed which is held on the chuck table, and the thickness of the object to be processed is calculated; a cooling liquid supply step, in which cooling liquid is continuously supplied to the contact pin; and a cutting step, in which, after the step of calculating the thickness of the object to be processed is implemented, the cutting blade of the cutter cutting component is positioned at a preset height according to the height position of the upper surface of the object to be processed, and is rotated to enable the relative movement of the cutter cutting component and the chuck table, such that the upper surface of the object to be processed is subjected to rotary cutting by the cutter cutting component.

Description

technical field [0001] The present invention relates to a cutting method for rotary cutting a workpiece such as a wafer by using a cutter. Background technique [0002] There are various technologies for achieving thinner, lighter and smaller semiconductor devices. As an example, a plurality of metal protrusions called bumps with a height of about 10 to 100 μm are formed on the surface of a device formed on a semiconductor wafer, and these bumps are directly bonded to electrodes formed on a wiring board, A mounting technique called flip chip bonding (flip chip bonding) has been put into practical use. [0003] The bumps formed on the device surface of the semiconductor wafer are formed by methods such as electroplating or stud bumps. Therefore, the height of each bump is not uniform, and it is difficult to directly bond all of the plurality of bumps to the electrodes of the wiring board uniformly. [0004] In addition, in order to achieve high-density wiring, there is an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02B28D7/02
CPCB28D5/007B28D5/022B28D7/005H01L21/67092
Inventor 松田智人
Owner DISCO CORP
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