Heat dissipating system and blade server

A blade server and heat dissipation system technology, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem of less research on memory liquid cooling technology, different memory quantity and spacing, and difficult unified design of liquid cooling products and other issues, to achieve the effect of improving cooling efficiency and speed, uniform distribution and recovery, and high cooling efficiency

Inactive Publication Date: 2013-09-25
SUGON INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the industry has some research on CPU liquid cooling technology, but there is less research on memory liquid cooling technology. The main reason is that the diversification of server motherboards leads to differences in the number and spacing of memory, and it is difficult to uniformly design memory liquid cooling products. , there are certain limitations in the promotion of

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  • Heat dissipating system and blade server

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Embodiment Construction

[0021] Now refer to figure 1 The heat dissipation system of the present invention is described, which includes at least two liquid cooling block groups 1 , a liquid inlet pipe 5 and a first liquid distribution block 6 , a liquid outlet pipe 7 and a second liquid distribution block 8 , and an intermediate liquid distribution block 9 . Wherein, each liquid cooling block group 1 has at least two liquid cooling blocks 2, and each liquid cooling block 2 includes a refrigerant inlet 3 and a refrigerant outlet 4, and one end of the first liquid sub-block 6 communicates with the liquid inlet pipe 5, and the other One end communicates with the refrigerant inlet 3 of each liquid cooling block 2 in the liquid cooling block group 1 respectively. Further, one end of the second liquid separation block 8 communicates with the liquid outlet pipe 7 , and the other end communicates with the refrigerant outlets 4 of the liquid cooling blocks 2 in the liquid cooling block group 1 respectively. T...

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Abstract

The invention provides a heat dissipating system, and further provides a blade server. The heat dissipating system comprises at least two liquid cooling block groups (1), a liquid inlet pipe (5), a first liquid distributing block (6), a liquid outlet pipe (7), a second liquid distributing block (8) and a middle liquid distributing block (9), wherein each liquid cooling block group (1) is provided with at least two liquid cooling blocks (2), and each liquid cooling block (2) comprises a coolant inlet (3) and a coolant outlet (4); one end of the first liquid distributing block (6) is communicated with the liquid inlet pipe (5), and the other end of the first liquid distributing block (6) is communicated with each coolant inlet (3) of each liquid cooling block (2) in each liquid cooling block group (1); one end of the second liquid distributing block (8) is communicated with the liquid outlet pipe (7), and the other end of the second liquid distributing block (8) is communicated with each coolant outlet (4) of each liquid cooling block (2) in each liquid cooling block group (1); the two ends of the middle liquid distributing block (9) are communicated with every two adjacent liquid cooling block groups (1) respectively. The heat dissipating system and the blade server can at least achieve fast, efficient and even distribution and recycling of coolants used for cooling.

Description

technical field [0001] The invention relates to a cooling system and a blade server. Background technique [0002] Most common servers rely on cold air to cool down the machine, and water cooling or liquid cooling has two advantages: first, it directs the coolant directly to the heat source, rather than indirect cooling like air cooling; second, compared with air cooling, each unit The heat transported by the volume, that is, the heat dissipation efficiency is as high as 3500 times. Water-cooled radiators appeared in the market around 2008, and various server giants and other companies focusing on data center technology have successively launched water-cooled heat dissipation products. [0003] Evaporative cooling uses the latent heat of vaporization when the fluid boils to remove heat from the thermal principle. This cooling method using the latent heat of vaporization when the fluid boils is called "evaporative cooling". Since the latent heat of vaporization of the flui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 沈卫东邵宗有李可李春乐张卫平
Owner SUGON INFORMATION IND
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