High heat conducting and insulating metal matrix printed circuit board
A printed circuit board, insulating metal technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the difficult to meet the requirements of high-power electronic components heat dissipation, difficult to meet the heat dissipation of high-power electronic components, harsh requirements and other issues, to achieve the effects of stable and reliable product quality, easy control of process parameters and high production efficiency
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Embodiment 1
[0022] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal-metal base, a metal transition layer formed sequentially on the metal-metal base, an AlON ceramic layer formed by CVD, and a metal layer formed on the ceramic layer. conductive layer. The metal-based printed circuit board is prepared by the above method, wherein the step of depositing the metal transition layer in step 130 adopts the following process: the degree of vacuum is 5.0×10 -4 Pa, into the vacuum coating chamber with a purity of 99.99% Ar, flow 20sccm, and keep the working vacuum in the vacuum coating chamber at 50 Pa, turn on a pair of intermediate frequency sputtering power supplies with metal target sputtering cathodes, power 10 kW; and turn on the bias power supply at the same time. The bias power supply is a high-frequency pulse bias power supply with a voltage of 50V, a frequency of 20kHz, and a duty cycle of 90%. The substrate deposition tempe...
Embodiment 2
[0024] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal-metal base, a metal transition layer sequentially formed on the metal-metal base, a SiON ceramic layer formed by CVD, and a metal layer formed on the ceramic layer. conductive layer. The metal-based printed circuit board is prepared by the above method, wherein the step of depositing the metal transition layer in step 130 adopts the following process: the degree of vacuum is 5.0×10 -4 Pa, into the vacuum coating chamber with a purity of 99.99% Ar, flow 20sccm, and keep the working vacuum in the vacuum coating chamber at 50 Pa, turn on a pair of intermediate frequency sputtering power supplies with metal target sputtering cathodes, power 10 kW; and turn on the bias power supply at the same time. The bias power supply is a high-frequency pulse bias power supply with a voltage of 50V, a frequency of 20kHz, and a duty cycle of 90%. The substrate deposition temper...
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