High heat conducting and insulating metal matrix printed circuit board

A printed circuit board, insulating metal technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the difficult to meet the requirements of high-power electronic components heat dissipation, difficult to meet the heat dissipation of high-power electronic components, harsh requirements and other issues, to achieve the effects of stable and reliable product quality, easy control of process parameters and high production efficiency

Active Publication Date: 2013-09-25
苏州汾湖投资集团有限公司
View PDF3 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]At present, the conductive circuit substrates of electronic products are mostly made of metal substrates that have undergone insulation and heat conduction heat treatment, but this circuit board structure is becoming more and more difficult to meet the needs of high-power electronics Components have strict requirements on heat dissipation
Metal substrate printed circuit boards in the prio

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal-metal base, a metal transition layer formed sequentially on the metal-metal base, an AlON ceramic layer formed by CVD, and a metal layer formed on the ceramic layer. conductive layer. The metal-based printed circuit board is prepared by the above method, wherein the step of depositing the metal transition layer in step 130 adopts the following process: the degree of vacuum is 5.0×10 -4 Pa, into the vacuum coating chamber with a purity of 99.99% Ar, flow 20sccm, and keep the working vacuum in the vacuum coating chamber at 50 Pa, turn on a pair of intermediate frequency sputtering power supplies with metal target sputtering cathodes, power 10 kW; and turn on the bias power supply at the same time. The bias power supply is a high-frequency pulse bias power supply with a voltage of 50V, a frequency of 20kHz, and a duty cycle of 90%. The substrate deposition tempe...

Embodiment 2

[0024] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal-metal base, a metal transition layer sequentially formed on the metal-metal base, a SiON ceramic layer formed by CVD, and a metal layer formed on the ceramic layer. conductive layer. The metal-based printed circuit board is prepared by the above method, wherein the step of depositing the metal transition layer in step 130 adopts the following process: the degree of vacuum is 5.0×10 -4 Pa, into the vacuum coating chamber with a purity of 99.99% Ar, flow 20sccm, and keep the working vacuum in the vacuum coating chamber at 50 Pa, turn on a pair of intermediate frequency sputtering power supplies with metal target sputtering cathodes, power 10 kW; and turn on the bias power supply at the same time. The bias power supply is a high-frequency pulse bias power supply with a voltage of 50V, a frequency of 20kHz, and a duty cycle of 90%. The substrate deposition temper...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Thicknessaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Login to view more

Abstract

The invention relates to a high heat conducting and insulating metal matrix printed circuit board. The circuit board comprises a metal substrate, a metal transition layer, a ceramic layer and a metal conducting layer, wherein the ceramic layer is formed through a CVD method, the metal conducting layer is formed on the ceramic layer in sequence, and the heat conducting coefficient of the ceramic layer is larger than 50W/mK. By depositing the metal transition layer and the ceramic layer with high heat conductivity on the metal substrate, the integrated printed circuit board with high integration level can be formed to serve as a circuit board substrate. In addition, a preparation method and a technological parameter of the high heat conducting and insulating metal matrix printed circuit board are easy to control, and the high heat conducting and insulating metal matrix printed circuit board is simple in step, reliable and stable in production quality, high in production efficiency and low in manufacturing method.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and more specifically, the invention relates to a metal-based printed circuit board with high thermal conductivity and insulation and a preparation method thereof. Background technique [0002] At present, the conductive circuit substrates of electronic products are mostly made of metal substrates that have undergone insulation and heat conduction heat treatment, but this circuit board structure is becoming more and more difficult to meet the stringent requirements for heat dissipation of high-power electronic components. Metal substrate printed circuit boards in the prior art usually include a metal substrate, an insulating layer formed on the substrate, and a metal conductive circuit formed by the insulating layer; wherein the insulating layer is currently mainly organic materials such as resin, although its insulation is good , but the thermal conductivity is poor, and it is dif...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/05H05K3/00
Inventor 高鞠
Owner 苏州汾湖投资集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap