Method for plating nickel by improving additive adding sequence

An additive and nickel-plating technology, applied in the direction of cells, electrolytic process, electrolytic components, etc., to achieve the effect of improving quality, good flatness, and less pinholes on the surface

Inactive Publication Date: 2013-10-02
SUZHOU SHINHAO MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, some unnecessary R&D and production costs may be incurred, and it is difficult to fundamentally solve the problem

Method used

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with specific preferred embodiments, so that the advantages and characteristics of the present invention can be more easily understood by those skilled in the art. These embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. limited.

[0018] The nickel plating method that the present invention improves additive addition sequence comprises the steps:

[0019] (1) The nickel-containing chemical solution required for nickel plating is the mother liquor system, which includes nickel-containing 110g / L nickel sulfamate aqueous solution, 40g / L boric acid and 80ml / L anode activator.

[0020] (2) Mix the supplement and wetting agent at a volume ratio of supplement: wetting agent = 20:1 and stir for 28 to 32 minutes, stir the supplement and wetting agent evenly, and then mix the supplement evenly Add the mother liquor system with wetting agent;

[00...

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Abstract

The invention discloses a method for plating nickel by improving an additive adding sequence and relates to a nickel plating process of a semiconductor product. Before electroplating, a replenisher and a wetting agent are blended and uniformly stirred, the replenisher and the wetting agent which are stirred and uniformly blended are added into a mother liquid system, the quality of a nickel plated layer can be effectively improved by controlling the adding sequence of additives, the nickel plated layer is very good in brightness and flatness, and very few needle holes are formed in the surface of the nickel plated layer. Meanwhile, the method can provide a using instruction of the additives to an electroplating client and can help the client to judge the performance of the electroplating additives, the method is low in cost, and a representation instrument which is high in price is not required, so that the using cost of the electroplating client can be greatly reduced, and the economic benefit of the client can be improved.

Description

technical field [0001] The invention relates to the technical field of electroplating of electronic products and semiconductor products, in particular to an additive addition method in the electroplating process. Background technique [0002] The technology of high-brightness mirror nickel plating began in the early 20th century. After four stages of development, it reached a relatively high level in the 1980s. The new generation of high-bright nickel plating technology is attributed to the use of new additives and wetting agents (or anti-pinhole agents), which are characterized by soft, mirror-bright surfaces, good deep plating ability, and low material consumption within 2min-5min. metal nickel plating. The previous technology mainly focused on the selection of additives and wetting agents and the exploration of formulations, and some progress has been made in the mechanism. [0003] However, there are few studies in the existing literature or reference materials on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14
Inventor 马涛张芸
Owner SUZHOU SHINHAO MATERIALS
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