LED integration package structure based on two-sided silicon substrate and production method of structure

Abstract

The invention discloses an LED (Light-emitting Diode) integration package structure based on a two-sided silicon substrate and a production method of the structure. The structure is characterized in that wires, LED chips and drive chips are integrated on the two side faces of the silicon substrate; the structure is small in size, and flexible, saves bracket cost, and does not require external drive; a lamp is simple to assemble; the wires are integrated on the silicon substrate; connections and lengths of conductors are reduced; and heat resistance of mechanical connection is reduced, so that the power loss of electric connection is lowered, and power is increased. The production method of the structure can adopt a micromachining technology; etching and wiring of a micro dimension is controlled accurately; the LED chips and the drive chips are mounted and packaged precisely; the size of the structure is decreased as far as possible; a three-dimensional package technology is adopted to integrally package elements on the two sides of the silicon substrate; the area of the substrate can be utilized sufficiently; the dimension of an LED module is decreased; an additional drive module is not required due to miniaturization of the LED module; a larger space can be made for placing other control modules due to heat sink of the lamp; and intelligent illumination is realized.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to an LED integrated packaging structure and a manufacturing method based on a double-sided silicon substrate. Background technique [0002] At present, LED packaging technology mainly includes the connection of three parts: LED module, heat sink and circuit. [0003] 1. LED module: The LED module is to package one or more LED light sources on the substrate. The most common packaging method is to package the LED chip in a bracket, and then solder the package body to the lead frame on the substrate. There are also further integrated packaging of LEDs on the substrate, and other circuits or control components, such as Zener diodes, optical sensing elements for light output and junction temperature testing, etc. are packaged on the same substrate, and the circuits on the PCB board are mutually connect. [0004] 2. Radiator: LED modules are usually connected to a radiator, and the heat ge...

AI Technical Summary

Problems solved by technology

[0006] The existing LED packaging structure requires additional connection to the drive module, and requires packaging brackets, etc., which has problems such as large volume, cost of brackets, and complicated assembly of lamps.

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