A highly conductive thermal insulating metal base printed circuit board

A technology of printed circuit boards and insulated metals, applied in the field of high thermal conductivity insulating metal-based printed circuit boards and its preparation, can solve the problem of difficulty in meeting the heat dissipation requirements of high-power electronic components, the difficulty in meeting the heat dissipation of high-power electronic components, and poor thermal conductivity and other issues, to achieve stable and reliable product quality, easy control of process parameters, and high production efficiency

Active Publication Date: 2013-10-02
苏州汾湖投资集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]At present, the conductive circuit substrates of electronic products are mostly made of metal substrates that have undergone insulation and heat conduction heat treatment, but this circuit board structure is becoming more and more difficult to meet the needs of high-power electronics Components have strict requirements on heat dissipation
Metal substrate printed circuit boards in the prior art usually include a metal substrate, an insulating layer formed on the substrate, and a metal conductive circuit formed by the insulating layer; wherein the insulating layer is currently mainly organic materials such as resin, although its insulation is good , but the thermal conductivity is poor, it is difficult to meet the heat dissipation requirements of high-power electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal base, a metal transition layer sequentially formed on the metal base, a SiN ceramic layer formed by reactive magnetron sputtering, and a SiN ceramic layer formed on the ceramic layer. metal conductive layer. The metal-based printed circuit board is prepared by the above method, wherein step 120 deposits the metal transition layer using the following process: the target material is a metal sputtering target with a purity of 99.99 wt%, and the background vacuum degree of the vacuum chamber is 5×10 -4 Pa, the flow rate of Ar is 20 sccm, the argon gas pressure is 2 Pa, the sputtering power of the sputtering target is 40W, the deposition temperature is 25°C, and the deposition thickness is 100nm; the metal layer deposited under these low temperature conditions has an amorphous structure It is a non-conductive structure, and its thermal conductivity is good. The u...

Embodiment 2

[0023] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal base, a metal transition layer sequentially formed on the metal base, an AlN ceramic layer formed by reactive magnetron sputtering, and an AlN ceramic layer formed on the ceramic layer. metal conductive layer. The metal-based printed circuit board is prepared by the above method, wherein step 120 deposits the metal transition layer using the following process: the target material is a metal sputtering target with a purity of 99.99 wt%, and the background vacuum degree of the vacuum chamber is 5×10 -4 Pa, the flow rate of Ar is 20 sccm, the argon gas pressure is 2 Pa, the sputtering power of the sputtering target is 40W, the deposition temperature is 25°C, and the deposition thickness is 100nm; the metal layer deposited under these low temperature conditions has an amorphous structure It is a non-conductive structure, and its thermal conductivity is good. The...

Embodiment 3

[0025] The highly thermally conductive insulating metal-based printed circuit board of this embodiment includes a metal base, a metal transition layer formed sequentially on the metal base, and an Al layer formed by reactive magnetron sputtering. 2 o 3 A ceramic layer, and a metal conductive layer formed on the ceramic layer. The metal-based printed circuit board is prepared by the above method, wherein step 120 deposits the metal transition layer using the following process: the target material is a metal sputtering target with a purity of 99.99 wt%, and the background vacuum degree of the vacuum chamber is 5×10 -4 Pa, the flow rate of Ar is 20 sccm, the argon gas pressure is 2 Pa, the sputtering power of the sputtering target is 40W, the deposition temperature is 25°C, and the deposition thickness is 100nm; the metal layer deposited under these low temperature conditions has an amorphous structure It is a non-conductive structure, and its thermal conductivity is good. The ...

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Abstract

The invention relates to a highly conductive thermal insulating metal matrix printed circuit board comprising a metal base body. A ceramic layer formed through a reaction magnetron sputtering method and a metal conducting layer formed on the ceramic layer are sequentially formed on the metal base body. According to the invention, through the adoption of the reaction magnetron sputtering deposition method, a transition layer and a highly thermal conducting layer are deposited on a metal substrate, and the metal substrate is regarded as a circuit board substrate to form an integrated printed circuit board with a high integration degree. The manufacturing method of the invention facilitates the control of technological parameters, and is simple in procedures. The product quality is stable and reliable. The production efficiency is high, and the preparation cost is low.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and more specifically, the invention relates to a metal-based printed circuit board with high thermal conductivity and insulation and a preparation method thereof. Background technique [0002] At present, the conductive circuit substrates of electronic products are mostly made of metal substrates that have undergone insulation and heat conduction heat treatment, but this circuit board structure is becoming more and more difficult to meet the stringent requirements for heat dissipation of high-power electronic components. Metal substrate printed circuit boards in the prior art usually include a metal substrate, an insulating layer formed on the substrate, and a metal conductive circuit formed by the insulating layer; wherein the insulating layer is currently mainly organic materials such as resin, although its insulation is good , but the thermal conductivity is poor, and it is dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05C23C14/08C23C14/14C23C14/34
Inventor 高鞠
Owner 苏州汾湖投资集团有限公司
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