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LED display screen based on chip-on-board packaging technology and production method thereof

A technology of LED display screen and production method, which is applied in the directions of identification devices, electrical components, electrical components, etc., can solve the problems of limited heat dissipation of components, difficulty in preparing LED display screens with small dot pitch, etc. The effect of high application value and less glare

Inactive Publication Date: 2013-10-09
深圳市濠腾兴光电科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0003] However, with the development of technology, the requirements for the dot pitch of LED displays are getting higher and higher. SMT is often limited by the heat dissipation of components and the size of the LED package, and it is difficult to prepare LED displays with small dot pitches.

Method used

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  • LED display screen based on chip-on-board packaging technology and production method thereof
  • LED display screen based on chip-on-board packaging technology and production method thereof
  • LED display screen based on chip-on-board packaging technology and production method thereof

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] An embodiment of the present invention is a method for producing LED display screens based on COB technology, which includes the following steps.

[0023] S1. According to the target, the area of ​​the display module is 0.01 to 1 square meters, and the dot pitch is 1 to 10 mm. According to the preset control method, the wiring is made into a PCB circuit board; the display module is the display unit, which is assembled into an LED display box. , and the LED display box is assembled into an LED display, or the display module is assembled into an LED display. For example, the control lines are wired in a series-parallel combination and a specific control method to make a PCB circuit board. Preferably, in S1, the PCB circuit board with an area of ​​0.06 to 0.6 square meters is produced; preferably, the PCB circuit board with an area of ​​...

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Abstract

The invention discloses an LED display screen based on the chip-on-board packaging technology and a production method of the LED display screen. The production method includes the steps of manufacturing a PCB by wiring according to a preset control mode in the mode that the area of a target display module is 0.01-1 square meters and the dot distance is 1-10 millimeters, fixing LED light-emitting wafers to the PCB in a pasting mode according to the dot distance, forming matrix arrangement, then warming to bake at the premature of 100-160 DEG C for 60-120 minutes, welding connecting lines, fixing a black mask on the PCB, and injecting glue in through holes in the mask for solidification. The LED display screen achieves the effects of being low in heat resistance, high in luminous flux density, less in glare and even in light emitting and has the advantages of being low in manufacturing cost, high in reliability, large in video light angle, good in radiating effect and the like, the light, thin and high-resolution LED display screen can be manufactured, and the market application value is quite high.

Description

technical field [0001] The invention relates to the production of LED display screens, in particular to an LED display screen based on chip-on-board packaging technology and a production method thereof. Background technique [0002] Surface Mount Technology (Surface Mounted Technology, SMT) is currently the most popular technology and process in the electronics assembly industry. ) or on the surface of other substrates, soldering and assembly by reflow soldering or dip soldering, so that there is no need to drill and insert holes on the printed circuit board, and directly stick or solder the surface mount components to the surface of the printed board. position. [0003] However, with the development of technology, the requirements for the dot pitch of LED displays are getting higher and higher. SMT is often limited by the heat dissipation of components and the size of the LED package, and it is difficult to manufacture LED displays with small dot pitches. [0004] Therefo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04G09F9/33
Inventor 于德海
Owner 深圳市濠腾兴光电科技有限公司
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