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Structure and method for packaging rectangular high-luminous-flux LED formed by green chip and red phosphor

A technology of LED packaging and packaging method, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of brittle AllnGaP chip material, low LED brightness, easy damage, etc., to achieve flexible implementation methods, operability Strong, improve the effect of product quality and reliability

Inactive Publication Date: 2013-10-16
宁波协源光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The light-emitting chip in the existing LED package uses the AllnGaP chip. Since the AllnGaP chip is generally a single electrode, the positive and negative polarities cannot be changed during packaging. AllnGaP is the light-emitting wavelength of the chip itself, and its light-emitting wavelength cannot be adjusted. easily damaged
At the same time, LEDs packaged with AllnGaP chips have low brightness and high cost

Method used

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  • Structure and method for packaging rectangular high-luminous-flux LED formed by green chip and red phosphor
  • Structure and method for packaging rectangular high-luminous-flux LED formed by green chip and red phosphor
  • Structure and method for packaging rectangular high-luminous-flux LED formed by green chip and red phosphor

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Effect test

Embodiment 1

[0034] A method for encapsulating the strip-shaped high-luminous flux LED encapsulation structure of the above-mentioned green chip plus red phosphor powder, comprising the following steps:

[0035] (1) Place the double-electrode green light chip on the upper surface of the bowl, and connect the double-electrode green light chip to the electrodes on the bowl through wires. Wherein, the dual-electrode green light chip may be an InGaN chip, and the wavelength of the InGaN chip is 515nm.

[0036] (2) Prepare the red fluorescent powder colloidal layer, the specific sub-step is to stir the red fluorescent powder and epoxy resin or silica gel at room temperature for 2 minutes, and the rotation speed during stirring is 2000 rpm. Among them, the red phosphor is (SrCa)AlSiN3:Eu / CaAlSin3:Eu, the concentration is 5%. The red fluorescent powder can be uniformly distributed by means of stirring, so that the light emission of the LED packaging structure is more uniform.

[0037] (3) Put t...

Embodiment 2

[0041] A method for encapsulating the strip-shaped high-luminous flux LED encapsulation structure of the above-mentioned green chip plus red phosphor powder, comprising the following steps:

[0042] (1) Place the double-electrode green light chip on the upper surface of the bowl, and connect the double-electrode green light chip to the electrodes on the bowl through wires. Wherein, the dual-electrode green light chip may be an InGaN chip, and the wavelength of the InGaN chip is 517.5 nm.

[0043] (2) Prepare the red fluorescent powder colloidal layer, the specific sub-step is to stir the red fluorescent powder and epoxy resin or silica gel at room temperature for 2.5 minutes, and the rotation speed during stirring is 2150 rpm. Among them, the red phosphor is (SrCa)AlSiN3:Eu / CaAlSin3:Eu with a concentration of 12.8%. The red fluorescent powder can be uniformly distributed by means of stirring, so that the light emission of the LED packaging structure is more uniform.

[0044]...

Embodiment 3

[0048] A method for encapsulating the strip-shaped high-luminous flux LED encapsulation structure of the above-mentioned green chip plus red phosphor powder, comprising the following steps:

[0049] (1) Place the double-electrode green light chip on the upper surface of the bowl, and connect the double-electrode green light chip to the electrodes on the bowl through wires. Wherein, the dual-electrode green light chip may be an InGaN chip, and the wavelength of the InGaN chip is 520nm.

[0050](2) Prepare the red fluorescent powder colloidal layer, the specific sub-step is to stir the red fluorescent powder and epoxy resin or silica gel at room temperature for 3 minutes, and the rotation speed during stirring is 2250 rpm. Among them, the red phosphor is (SrCa)AlSiN3:Eu / CaAlSin3:Eu with a concentration of 20.7%. The red fluorescent powder can be uniformly distributed by means of stirring, so that the light emission of the LED packaging structure is more uniform.

[0051] (3) P...

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Abstract

The present invention relates to a structure and a method for packaging a rectangular high-luminous-flux LED formed by a green chip and red phosphor. The structure comprises a frame and a dual-electrode green chip. The frame includes a bowl cup and a cup wall. The bowl cup has a rectangular structure. The cup wall has a triangular longitudinal section, and is positioned at the edge of the bowl cup. The cup wall has a rounded rectangle shape at the rim of the cup. The dual-electrode green chip is mounted on the upper surface of the bowl cup and is connected with electrodes of the bowl cup by two wires. A red phosphor glue layer is solidified around the dual-electrode green chip. The method comprises: placing the dual-electrode green chip onto the bowl cup and connecting the wire; preparing the red phosphor glue layer; arranging the red phosphor glue layer in the bowl cup on the frame; and solidifying the red phosphor glue layer, and completing the packaging. By the structure and method provided by the invention, the luminance is improved and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a rectangular high-luminous flux LED packaging structure and method with a green chip and red phosphor powder added. Background technique [0002] The light-emitting chip in the existing LED package uses an AllnGaP chip. Since the AllnGaP chip is generally a single electrode, the positive and negative polarities cannot be changed during packaging. AllnGaP is the light-emitting wavelength of the chip itself, and its light-emitting wavelength cannot be adjusted. easily damaged. At the same time, LEDs packaged with AllnGaP chips have low brightness and high cost. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a rectangular high-luminous flux LED packaging structure and method with green chips and red phosphor powder, which can improve luminous brightness and reduce costs. [0004] The technical solution adopted ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L2224/48091H01L2924/00014
Inventor 应园
Owner 宁波协源光电科技股份有限公司