75results about How to "High quality and reliability" patented technology

A heat exchanger which, while having excellent heat exchanging performance, has a structure easy to produce, is of low cost, and has high quality and reliability. The heat exchanger has first base plates (26), in each of which first slits (30) and second slits (40) are provided in substantially parallel to each other, and has second base plates (28), in each of which third slits (50) with substantially the same shape as a first slit (30) are provided. The length in the longitudinal direction of a second base plate (28) is set to be less than the length of a second slit (40). The first base plates (26) and the second base plates (28) are layered over each other such that the first slits (30) provided in the first base plates (26) and the third slits (50) provided in the second base plates (28) are communicated. Flow paths (60) outside tubes are constructed by the first slits (30) provided in the first base plates (26) and the third base plates (50) provided in the second base plates (28). Flow paths (70) inside the tubes are constructed by the second slits (40) provided in the first base plates (26) and the second base plates (28). Since a heat exchanging section formed only by tubes can be constructed by the base plates with the slits, the heat exchanger can be easily produced. Further, the heat exchanger can be provided at low cost.

A wiring repair apparatus includes an XY stage on which a substrate is placed, a laser source unit disposed above the XY stage, first and second gas windows disposed between the laser source unit and the XY stage, and first and second CVD gas units. The laser source unit emits a laser beam to a part of the substrate to be repaired. This laser beam passes through either the first or second gas window. The first CVD gas unit supplies an Al source gas (DMAH gas) to the first gas window while the second CVD gas unit supplies a Cr source gas (Cr(CO)6 gas) to the second gas window.

A pad (15) is provided on a surface connecting a first substrate (11) of a lower layer module with an upper layer module, the pad is partially covered by an insulating film (20) to form an opening section (3) exposing the pad (15), a first connection terminal (2) is formed on the lower surface of the first substrate (11) of the lower layer module, the planar shape of the opening section (3) is different from the planar shape of the first connection terminal (2), the outer shape of the opening section (3) is larger than the first connection terminal (2), and in a transmissive inspection from above, the shape of the lower end of a second connection terminal (30) spreading in the opening section (3) is not concealed by the other terminal. This configuration enables easy and reliable determination of whether bonding sections are satisfactory by a non-destructive inspection.

The purpose of the present invention is to provide a repair / modification method for metallic substrates that is capable of reducing both defects and regions of interface in the interior of a structural body by means of modifying the arrangement deep into the interior of a structural body while preventing impurities that, for example, originate with a probe on a friction stir welding tool from being mixed into the interior of the structural body. The repair / modification method for metallic substrates pertaining to the present invention involves: a step for preparing a metallic substrate havinga first region that is divided in the in-plane direction of the substrate and contains a defect and / or a structurally discontinuous part; and a step for repairing the defect and / or modifying the structurally discontinuous part by causing a probeless friction tool to be rotatingly pressed against the surface of the first region, thereby generating frictional heat while pressing on the surface.

A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

There is provided a servo controller for a spot welding gun for controlling a pressurizing force, applied by a pair of mutually-opposing gun chips, on an object to be welded, including at least one movable gun chip, which is held between the pair of gun chips, by causing a drive source of the movable gun chip to drive the movable gun chip in a direction in order to pressurize the object to be welded. The servo controller includes a feedback control section for calculating a difference value (F c - F) between an obtained pressurizing-force value F and a required pressurizing-force value F c , and a feedforward control section for adding a correcting command value, obtained from a position command value or a speed command value for the drive source, to the difference value (F c - F).