Multilayer rigid-flex board plated filled through-hole manufacturing process

Abstract

The invention discloses a multilayer rigid-flex board plated filled through-hole manufacturing process, and belongs to the technical field of circuit board manufacturing processes. The multilayer rigid-flex board plated filled through-hole manufacturing process is technically characterized by including the steps: (1) cutting; (2) drilling; (3) electroless copper plating; (4) copper plating; (5) circuit manufacture; (6) sealing; (7) press fit; (8) drilling; (9) plasma cleaning; (10) electroless copper plating; (11) copper pre-plating; (12) filled hole plating. In the step (2), the drilling aperture is smaller than or equal to 0.12mm. Electroplate liquid comprises sulfuric acid H2SO4, copper sulfate CuSO4, acidic brightening agents, inhibitors, leveling agents and hydrochloric acid HCl. The multilayer rigid-flex board plated filled through-hole manufacturing process is simple and used for plated filled through-holes in circuit board manufacture, the assembly size of a board is decreased, and assembly flexibility is improved.

Description

technical field [0001] The invention relates to a process for filling through holes by electroplating, and more specifically, relates to a process for making through holes by electroplating and filling a multi-layer rigid-flex board. Background technique [0002] With the development trend of "light, thin, short and small" printed circuit boards, the diversification and modularization of products are becoming more and more obvious, and the requirements for circuit design and production methods of electronic products are also getting higher and higher. The circuit has been unable to meet the requirements of electronic products. In order to reduce board assembly size and weight, avoid wiring errors, increase assembly flexibility, improve reliability, and realize three-dimensional assembly under different assembly conditions, electroplating fills through holes in the electroplating of rigid-flex boards. The so-called electroplating to fill the through hole means that the throu...

AI Technical Summary

Problems solved by technology

[0008] This process uses a method similar to a sewing machine to thread the flexible circuit board. Although the process of drilling dirt after drilling in the traditional process is subtracted, electroless copper deposition is not required, and the plating time is shortened. The expansion and contraction of the base material during the process can easily cause poor contact between the copper wire and the insulating hole wall, or even no contact at all, so that the reliability of the electrical connection cannot be guaranteed, resulting in the scrapping of the board