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A rapid quality detection method for cobalt-silicon compounds based on reflection spectrum fitting

A quality inspection method and reflectance spectroscopy technology, applied in the field of wafer processing quality inspection, can solve the problems of cost and time waste, achieve the effect of saving cost, avoiding cost and time waste, and facilitating the inspection process

Active Publication Date: 2018-01-02
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantage is that using this method to detect abnormal cobalt-silicon compounds is a very long process cycle, resulting in a lot of waste of cost and time

Method used

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  • A rapid quality detection method for cobalt-silicon compounds based on reflection spectrum fitting
  • A rapid quality detection method for cobalt-silicon compounds based on reflection spectrum fitting
  • A rapid quality detection method for cobalt-silicon compounds based on reflection spectrum fitting

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Embodiment Construction

[0025] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] In the semiconductor fab, there are many reflection spectrum metrology tools configured for various thickness measurements in the wafer processing process. The reflection spectrum measurement tools adopt the reflection spectrum fitting metrology system of NOVA or KT.

[0027] Such as figure 1 Shown, a kind of embodiment based on the fast cobalt-silicon compound quality detection method of reflection spectrum fitting, this method comprises the following steps:

[0028] Step 1, such as figure 2 Shown is a schematic structural view of an embodiment of a semiconductor device on which a cobalt-silicon compound 1 has been formed. A gate oxide 2 is formed in the middle region of the silicon substrate, an N+ polysilicon 3 is formed on the gate oxide 2, and sidewall linings 4 are formed on both sides of the gate oxide 2 and the N+ polysilicon 3, The ...

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Abstract

The invention discloses a fast cobalt-silicon compound quality detection method based on reflection spectrum fitting, comprising: 1. After the cobalt-silicon compound is formed, a reflection spectrum measurement tool irradiates a probe beam on the area where the cobalt-silicon compound is formed; 2. Reflection spectrum The metrology tool receives the probe beam reflected back from the area where the cobalt-silicon compound is formed; 3. The reflection spectrum metrology tool makes its reflection spectrum according to the reflected probe beam; 4. The reflection spectrum metrology tool makes its corresponding light according to the reflection spectrum Intrinsic curve; 5. According to the intrinsic curve of the reflection spectrum of light, it is judged whether the proportion of each compound in the area where the cobalt-silicon compound is formed meets the process requirements. If so, the subsequent process is performed on the wafer, and if not, the abnormal process is stopped. Production. The invention adopts reflectance spectrum to quickly detect the quality of the cobalt-silicon compound on-line, avoiding a lot of waste of cost and time, and reducing losses.

Description

technical field [0001] The invention relates to a wafer processing quality detection technology in the field of semiconductors, in particular to a fast cobalt-silicon compound quality detection method based on reflection spectrum fitting. Background technique [0002] Cobalt silicide has low resistivity and high thermal stability, making it a suitable material for VLSI applications at the 0.18 / 0.90um node. [0003] Cobalt silicide is usually formed by a two-step thermal process: [0004] Co + Si --- CoSi (450°C); [0005] CoSi + Si --- CoSi2 (700°C); [0006] According to the above formula, first at 450°C, cobalt and silicon are combined into cobalt silicide (CoSi) through thermal process, and then heated to 700°C, at 700°C, cobalt silicide (CoSi) CoSi) and silicon are converted into cobalt disilicide (CoSi2) through thermal process, which is commonly referred to as cobalt silicide. [0007] Heat control is crucial for cobalt-silicon compounds. By increasing the temperat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06H01L21/66
Inventor 李协喆李志国
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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