A rapid quality detection method for cobalt-silicon compounds based on reflection spectrum fitting
A quality inspection method and reflectance spectroscopy technology, applied in the field of wafer processing quality inspection, can solve the problems of cost and time waste, achieve the effect of saving cost, avoiding cost and time waste, and facilitating the inspection process
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[0025] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0026] In the semiconductor fab, there are many reflection spectrum metrology tools configured for various thickness measurements in the wafer processing process. The reflection spectrum measurement tools adopt the reflection spectrum fitting metrology system of NOVA or KT.
[0027] Such as figure 1 Shown, a kind of embodiment based on the fast cobalt-silicon compound quality detection method of reflection spectrum fitting, this method comprises the following steps:
[0028] Step 1, such as figure 2 Shown is a schematic structural view of an embodiment of a semiconductor device on which a cobalt-silicon compound 1 has been formed. A gate oxide 2 is formed in the middle region of the silicon substrate, an N+ polysilicon 3 is formed on the gate oxide 2, and sidewall linings 4 are formed on both sides of the gate oxide 2 and the N+ polysilicon 3, The ...
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