Backside off-axis alignment system, photolithography device and method based on array photoelectric sensor

Abstract

The invention discloses a backside off-axis alignment system based on an array photoelectric sensor, which is used to determine the relative positional relationship between a substrate and a workpiece table, wherein the workpiece table has a first surface and a second surface opposite to the second surface. a surface for supporting the substrate and providing movement of the substrate, the back of the substrate is in contact with the first surface of the workpiece table, and the alignment system includes: an imaging optical system for at least one alignment mark on the back of the substrate An image is formed above the first surface of the workpiece table; an array photoelectric sensor is used to detect the image of the alignment mark, wherein the array sensor includes a plurality of photoelectric sensors separated from each other, and the size of the photosensitive surface of each photoelectric sensor is larger than the alignment mark The distance between the photosensitive surfaces of any two photosensors is smaller than the minimum size of the image of the alignment mark; the control module is used to collect and process the image information of the alignment mark to determine the position of the back side of the substrate The position information of the alignment mark.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a backside off-axis alignment system based on an array photoelectric sensor, a photolithography device and a method. Background technique [0002] With the continuous improvement of people's living standards and the development of semiconductor technology, the semiconductor market will continue to increase the requirements for the intelligence and miniaturization of semiconductor packaging devices in the future. Digital products such as cameras, mobile phones, and PDAs are not only required to be small and easy to carry. It is also required to have multiple functions and low cost performance. In order to achieve the development requirements of intelligent and miniaturized packaging devices, there is a need for multi-silicon chip packaging solutions. Multi-wafer packaging is a silicon wafer-level packaging method that stacks and connects two or more plana...

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the defects in the prior art, the present invention provides a backside off-axis alignment system, photolithography device and method based on an array photoelectric sensor, which can effectively avoid the problem of low alignment efficiency caused by slow response speed of CCD sensors

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