Back off-axis alignment system based on array photoelectric sensor, and photoetching device and method

Abstract

The invention discloses a back off-axis alignment system based on an array photoelectric sensor, which is used for determining the relative positional relation between a base and a workpiece table, wherein the workpiece table is provided with a first surface and a second surface opposite to the first surface and is used for supporting the base and enabling the base to move; the back of the base is in contact with the first surface of the workpiece table. The alignment system comprises an imaging optical system, an array photoelectric sensor and a control module, wherein the imaging optical system is used for imaging at least one alignment marker on the back of the base above the first surface of the workpiece table; the array photoelectric sensor is used for detecting an image of the alignment marker; the array sensor comprises a plurality of separated photoelectric sensors; the size of a photosensitive surface of each photoelectric sensor is greater than the minimum size of the alignment marker, and the space between the photosensitive surfaces of any two photoelectric sensors is less than the minimum size of the image of the alignment marker; the control module is used for acquiring and processing image information of the alignment marker to determine positional information of the alignment marker on the back of the base.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a backside off-axis alignment system based on an array photoelectric sensor, a photolithography device and a method. Background technique [0002] With the continuous improvement of people's living standards and the development of semiconductor technology, the semiconductor market will continue to increase the requirements for the intelligence and miniaturization of semiconductor packaging devices in the future. Digital products such as cameras, mobile phones, and PDAs are not only required to be small and easy to carry. It is also required to have multiple functions and low cost performance. In order to achieve the development requirements of intelligent and miniaturized packaging devices, there is a need for multi-silicon chip packaging solutions. Multi-wafer packaging is a silicon wafer-level packaging method that stacks and connects two or more plana...

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the defects in the prior art, the present invention provides a backside off-axis alignment system, photolithography device and method based on an array photoelectric sensor, which can effectively avoid the problem of low alignment efficiency caused by slow response speed of CCD sensors

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