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Silicon-based LED module multi-layer superposition structure and manufacturing method

A technology of LED modules and manufacturing methods, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of non-standard connection port position and connection mechanism, difficulty in reducing size, large application size, etc., and achieve simplification of lamp assembly, Improve the heat dissipation effect and reduce the size of the finished product

Active Publication Date: 2015-12-30
GUANGDONG UNILUMIN ENERGY SAVINGS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this combination method, each component is independently designed, and the combination is difficult. Because the size is not uniform, the position of the connection port and the connection mechanism are not standardized, it is very difficult to use larger components for each component, and it is very difficult to reduce the size, and the existing technology cannot realize the optical module. and drive module superimposed connection into one modularization

Method used

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  • Silicon-based LED module multi-layer superposition structure and manufacturing method
  • Silicon-based LED module multi-layer superposition structure and manufacturing method

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Embodiment Construction

[0021] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0022] see figure 1 as well as figure 2 , a silicon-based LED module multi-layer superposition structure of the present embodiment, comprising a light source module layer and a driver module layer, the light source module layer and the driver module layer are stacked and welded by solder; the light source module The layer includes an upper substrate 1 and an LED chip 11, the surface of the upper substrate 1 opposite to the driving module layer is provided with a first groove 12, the LED chip 11 is arranged in the first groove 12, and the upper A first wire is arranged on the substrate 1, and the LED chip 11 is provided with a pin, and one end of the first wire is electrically connected to the pin of the LED chip 11; the driving module la...

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Abstract

A multilayer stacking structure of a silicon-based LED module, comprising a light source module layer and a drive module layer, wherein the light source module layer comprises an upper substrate (1) and an LED chip (11), the LED chip (11) being arranged in a first groove (12) of the upper substrate (1); and the drive module layer comprises a lower substrate (2) and a drive IC (21), the drive IC (21) being arranged in a second groove (22) of the lower substrate (2), the upper substrate (1) and the lower substrate (2) being superposed together. A manufacturing method for a multilayer stacking structure of a silicon-based LED module. Micro size etching, wiring and encapsulation corresponding to the LED chip (11) and the drive IC (21) can be accurately controlled using the micromachining technology. This integrated design simplifies lamp assembling, reduces electric connection power loss so that the power is improved, reduces system volume, reduces costs, and improves heat dissipation effects.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a silicon-based LED module multilayer stacked structure and a manufacturing method. Background technique [0002] At present, LED packaging refers to fixing the LED chip on the bracket, electrically connecting the LED chip and the bracket with gold wires, and then sealing it with silica gel. When assembling the lamp, the LED package is assembled on the substrate in SMT mode to form an optical module. Combine optical modules, drive circuit modules, housings, optical components, etc. In this combination method, each component is independently designed, and the combination is difficult. Because the size is not uniform, the position of the connection port and the connection mechanism are not standardized, it is very difficult to use larger components for each component, and it is very difficult to reduce the size, and the existing technology cannot realize the optical module. And the dr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L33/62H01L33/48
CPCH01L33/486H01L25/167H01L33/62H01L2924/0002H01L2924/00
Inventor 林洺锋韦嘉徐振雷梁润园张春旺胡丹包厚华
Owner GUANGDONG UNILUMIN ENERGY SAVINGS TECH