Light-emitting diode (LED) bulb lamp

Abstract

The invention discloses a light-emitting diode (LED) bulb lamp which comprises a radiating lamp body, a power source plate, a light-transmitting casing, an LED lamp board and a heat conduction aluminum sheet. The LED lamp board directly adheres to the heat conduction aluminum sheet, the radiating effect is ideal, the service life of the LED bulb lamp is prolonged, mixture of fluorescent powder and pearl powder is added in base materials of a lamp casing, or a coating of mixture of the fluorescent powder and pearl powder is arranged on the surface of the lamp casing, so that the LED can emit light secondarily. During manufacturing of an epitaxial wafer, pressure with direction opposite to that of force causing partial warping of a substrate is exerted on the substrate partially, the problem of warping of the substrate during epitaxial growth under high temperature can be effectively solved, substrate materials are saved, regular reduction operation is avoided, manufacturing cost of the LED epitaxial wafer and the LED bulb is remarkably reduced, light-emitting efficiency is improved by more than 20%, and the aim of saving energy and protecting the environment can be indirectly achieved.

Description

technical field [0001] The invention relates to an illuminating lamp, in particular to an LED illuminating lamp. Background technique [0002] As an energy-saving and clean light source, LED bulb lamps have a great tendency to replace traditional incandescent lamps and tungsten filament lamps. Since most of the electric energy in the work of LED bulb lamps is converted into heat energy and dissipated, the heat dissipation of LED bulb lamps The structure is particularly important. The existing LED bulb lamp includes a heat dissipation lamp body. One end of the heat dissipation lamp body is connected to the lamp cap, and the other end is fixed with an LED lamp board and a lampshade. A cavity is arranged in the middle of the heat dissipation lamp body. A power board is installed inside, and the power board is connected to the LED light board through insulated wires. Due to the small contact area between the LED light board and the heat dissipation lamp body, the heat generated ...

AI Technical Summary

Problems solved by technology

However, common substrate materials, especially sapphire materials, have poor thermal conductivity. After heating, they will warp due to the difference in surface tension between the upper and lower surfaces, or internal stress accumulation after depositing different films on the upper surface. For smaller sapphire substrates, the degree of warping is especially severe, which leads to the uneven temperature distribution along the radial direction of the epitaxial wafer during the growth of the epitaxially grown GaN layer, which affects the optoelectronic parameters, such as the emission wavelength, brightness or voltage, etc. Inhomogeneity, resulting in low yield

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