Mask alignment device and photoetching device using same

Abstract

The invention discloses a mask alignment device and a photoetching device using same. The mask alignment device comprises 1, an illumination system for providing a light source to irradiate a first mark and a second mark, 2, a projection objective lens for imaging the first mark, 3, a first support device for supporting the first mark, wherein the first mark is located on a mask plate, 4, a second support device for supporting the second mark, wherein the second mark is located on a reference plate, and 5, an imaging detection system for detecting the deviation of a first mark imaging position and a second mark position. The mask alignment device is characterized in that the imaging detection system is fixed in the second support device; the second mark is located in a view field of the imaging detection system; and the projection objective lens and the imaging detection system use the illumination system in common.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a mask alignment device and a lithography apparatus using the same. Background technique [0002] The photolithography method refers to the circuit pattern drawn on the reticle, which is imaged on the surface of the silicon wafer for the manufacture of integrated circuits coated with photoresist and other photosensitive materials through a projection exposure device, and then the silicon wafer for the manufacture of integrated circuits is produced by an etching process. form a graph. Lithography equipment refers to equipment that uses photolithography to manufacture integrated circuits. The lithography equipment is to project and expose the circuit pattern on the reticle through an optical system such as a projection exposure lens, and project the circuit pattern on the silicon wafer for manufacturing the integrated circuit at a certain magnification or ...

AI Technical Summary

Problems solved by technology

[0004] Patent US4683572 provides a mask alignment device, the patent mask alignment sensor is located between the projection objective lens and the exposure object, and the mask alignment sensor is located outside the projection objective lens exposure field of view, so the patent has structural The following deficiencies: the projection objective lens is required to have a larger image-side working distance, which will lead to a complex design of the projection objective lens structure, and increase the weight and cost of the projection objective lens due to the increased conjugate distance of the object image; on the other hand, when the mask is aligned It is necessary to add a separate mask mark lighting device, which makes the structure complex and high in cost; in addition, when the position of the mask alignment sensor drifts, the position drift cannot be obtained in real time, thus affecting the overlay accuracy of the whole machine

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