Crucible with heat conduction device

Abstract

The invention provides a crucible with a heat conduction device, comprising a crucible body and a heat conduction device arranged in the crucible body, wherein the heat conduction device is tree-shaped and comprises a heat dissipation trunk and a plurality of layers of heat dissipation branches arranged on the heat dissipation trunk, each layer of heat dissipation branch comprises a plurality of branch units, and the branch units are arranged by extending outwards from the outer surface of the heat dissipation trunk. For the crucible with the heat conduction device disclosed by the invention, since the tree-shaped heat conduction device is arranged in the crucible body, heat can be transferred to all directions of the crucible body, so that in evaporation, organic matters in the crucible body can be heated uniformly, the phenomenon in the prior art that partial organic material cracks due to non-uniform heating of the organic material is avoided, and the evaporation efficiency and the evaporation effect are effectively improved.

Description

technical field [0001] The invention relates to the field of display device production, in particular to a crucible with a heat conduction device used for vapor deposition of an organic material coating machine of an organic electroluminescence display device. Background technique [0002] Flat-panel display devices have many advantages such as thin body, power saving, and no radiation, and have been widely used. Existing flat panel display devices mainly include liquid crystal display devices (Liquid Crystal Display, LCD) and organic electroluminescence display devices (Organic Light Emitting Display, OLED). [0003] Existing liquid crystal display devices are generally backlight liquid crystal display devices, which include: a housing, a liquid crystal display panel disposed in the housing, and a backlight module disposed in the housing. The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates, an...

AI Technical Summary

Problems solved by technology

[0010] To solve this problem, heat conduction balls are mainly used at present. When filling organic materials into the crucible, heat conduction balls are mixed in, and the temperature of the material is made uniform through the heat transfer of heat conduction balls. However, this method is only suitable for sublimation materials. It has a good effect. Because the melting type material melts at high temperature, the density of the heat conduction ball and the organic material is different, and the heat conduction ball will gradually deposit on the bottom of the crucible, which cannot transfer heat well.

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