led chip and its preparation method

Abstract

The invention discloses an LED chip and a preparation method thereof. The LED chip comprises a substrate as well as an N type semiconductor layer, a luminous layer, a P type semiconductor layer and a transparent conducting layer which are sequentially located on the substrate, and the LED chip further comprises a P electrode which is located on the transparent conducting layer and electrically connected with the transparent conducting layer, as well as an N electrode which is located on the side of the transparent conducting layer and electrically connected with the N type semiconductor layer, wherein a plurality of unevenly distributed opening patterns are arranged on the transparent conducting layer, and the density distribution of the opening patterns correspond to that of current. The LED chip and the preparation method thereof adopt an imaging technology of the transparent conducting layer, so that the current can be uniformly injected into the whole LED chip to the greatest extent, the LED chip can work in a uniform luminous state, and the luminous efficiency of the LED chip is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting devices, in particular to an LED chip and a preparation method thereof. Background technique [0002] In the LED field, due to the poor conductivity of the P-type semiconductor on the surface of the diode, it is inevitable to use a transparent conductive film to extend the current to the entire LED light-emitting area without blocking the light. At present, the ITO film is the most used, which solves the problem of P-electrode current conduction to a certain extent. [0003] Although the transparent conductive film is called transparent, its transmittance to visible light is not 100%, and there is still a small amount of absorption. Part of the light emitted by the LED chip will be absorbed by it, reducing the brightness of the chip. The light absorption intensity of the transparent conductive film increases exponentially with its thickness, so it must be made as thin as poss...

AI Technical Summary

Problems solved by technology

Part of the light emitted by the LED chip will be absorbed by it, reducing the brightness of the chip. The light absorption intensity of the transparent conductive film increases exponentially with its thickness, so it must be made as thin as possible to increase the transmittance. This will bring another problem: the thinner the film, the higher the sheet resistance, and the power consumption of the chip will increase

When the sheet resistance of the two does not match, the chip will have a local injection current density that is too high, and the uneven distribution of the current will lead to a decrease in chip performance

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