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hot melt adhesive

A technology of hot-melt adhesives and melting points, applied in wax adhesives, adhesives, film/sheet adhesives, etc., can solve the problem of difficult bonding between the adherend and the base material, and achieve excellent low temperature Applicability, excellent heat resistance, effect of maintaining heat resistance

Active Publication Date: 2015-09-09
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Bonding of the adherend to the base material becomes difficult if the open time of the hot melt adhesive is too short

Method used

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Examples

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Embodiment Construction

[0030] In the present specification, "open time" refers to the time from when a hot-melt adhesive is applied to an adherend to when fluidity of the adhesive disappears so that the surface of the adherend cannot be wetted.

[0031] The hot melt adhesive related to the present invention comprises (A) ethylene-based copolymer and (B) wax, wherein (B) said wax comprises (B1) olefin copolymer wax modified by carboxylic acid or carboxylic anhydride .

[0032] In this specification, "hot-melt adhesive" is an adhesive which is solid at room temperature but becomes fluid by heating and melting, and which can be applied to objects such as base materials and adhered objects, etc., and hardens and adheres after cooling.

[0033] In the present specification, "(A) ethylene-based copolymer" is a copolymer of ethylene and other polymerizable monomers having a weight average molecular weight of 15,000 or more.

[0034] In the present invention, (A) ethylene-based copolymer and (B) wax are d...

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Abstract

The present invention provides a hot melt adhesive which is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Moreover, the present invention provides a paper product produced by using the hot melt adhesive. The present hot melt adhesive comprising (A) an ethylene-based copolymer and (B) a wax, wherein (B) the wax comprises (B1) a carboxylic acid or carboxylic acid anhydride-modified olefin copolymer wax, is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Furthermore, a paper product produced by using the present hot melt adhesive is provided.

Description

technical field [0001] The present invention relates to a hot melt adhesive. Furthermore, the present invention also relates to a paper product produced by using the hot melt adhesive of the present invention. Background technique [0002] Hot melt adhesives are solvent-free adhesives. The adhesive is applied to an adherend by heating and melting, and exerts an adhesive effect after cooling and solidifying. For this reason, it is characterized by instant adhesion and fast adhesion, and can be used in a wide range of fields, such as paper processing, wood products, sanitary products, and electronic fields. [0003] As the base polymer of the above-mentioned hot melt adhesive, the following can be widely used depending on the application: ethylene-based copolymers such as ethylene-vinyl acetate copolymer (hereinafter also referred to as "EVA") and ethylene- Ethyl acrylate copolymer (hereinafter, also referred to as "EEA"); olefin-based resins such as polyethylene, polypropy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/00C09J123/08C09J7/00C09J7/21C09J7/30
CPCC09J123/0815Y10T428/31808C09J7/041C09J123/0869C09J191/06C09J123/0853C09J7/30C09J7/21C08L51/06
Inventor A·高盛
Owner HENKEL KGAA