Clamping device used for measurement of thin plates
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- KUNSHAN YUNCO PRECISION IND TECH
- Publication Date
- 2013-11-20
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a measuring device, in particular to a clamping device for thin plate shape measurement. Background technique
[0002] In the fields of surface mount technology (SMT), precision thin board manufacturing, etc., precision thin boards are manufactured or used in large quantities. For example, the stencil base material used in the surface mount industry, the material types involve stainless steel, nickel, nickel alloy, etc., the thickness is generally within 1mm, and in the process of its processing, it needs to go through electroforming, electroplating, polishing, etching, laser cutting And other processes, semi-finished products and final finished products in the middle need to be measured for thickness uniformity to ensure that the final product meets customer requirements; in terms of precision thin plate manufacturing, such as various stainless steels provided by large steel mills for the surface mount industry, etc. The pla...