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A kind of fully crimping igbt module and its assembly method
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A positioning block, PCB board technology, applied in the direction of printed circuits, electrical components, electrical solid devices connected to non-printed electrical components, etc., can solve the problem that the internal space is not effectively utilized, the processing and manufacturing is difficult, and the module structure is complex, etc. problem, to achieve the effect of simple and compact overall structure, reduced design cost, and simple assembly process
Active Publication Date: 2016-04-20
STATE GRID CORP OF CHINA +2
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After adopting this structure, the rectangular electrode group needs to be processed, and the internal space has not been effectively utilized. In addition, the gate of the IGBT chip needs to be led out to the PCB through spring pins, and the PCB also needs to be fixed, which makes the structure of the module more complex and difficult to process. It is very difficult to manufacture, and there is a certain risk in the connection of spring pins in a vibration environment, which may lead to poor contact or even instant disengagement, which may cause serious consequences
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Embodiment 1
[0038] The present invention also provides an assembly method of fully crimped power devices. As a preferred example, wiring is buried inside the PCB to lead out the grid of the IGBT chip, and the PCB is simultaneously used as a positioning device for the chip, molybdenum sheet, and silver sheet , and follow figure 2 with image 3 Assembled according to the assembly relationship shown, the specific assembly steps are as follows:
[0039] ①Press the upper molybdenum sheet, IGBT chip, lower molybdenum sheet and silver sheet of the IGBT assembly into the holes of the protruding pole of the PCB board in sequence, and at the same time press the upper molybdenum sheet, diode chip, lower molybdenum sheet and silver sheet of the diode chip assembly Press into the hole without the protruding pole of the PCB board;
[0040] ② Place the PCB board on the lower end cover of the fully crimped power device according to the PCB board positioning block;
[0041] ③ Lead out the gate line of...
Embodiment 2
[0044] As another example, a bushing can be added between the chip component and the PCB board (the bushing is made of high-temperature-resistant, high-voltage insulating material), so that it is easier to meet the positioning accuracy and assembly relationship, and the assembly steps are as follows:
[0045] Put the upper molybdenum sheet, IGBT chip, lower molybdenum sheet and silver sheet of the IGBT assembly into the bushing sequentially; at the same time, install the upper molybdenum sheet, diode chip, lower molybdenum sheet and silver sheet of the diode chip assembly into the bushing sequentially Inside;
[0046] Insert the bushing with IGBT components into the protruding pole hole of the PCB board, press the bushing with the diode component into the protruding pole hole without PCB board;
[0047] Place the PCB board that has passed step on the lower end cover of the fully crimped power device according to the PCB board positioning block;
[0048] Pull out the gate ...
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Abstract
The invention relates to a power device and an assembling method thereof in the technical field of power semiconductor devices, in particular to an all-crimping type insulated gate bipolar transistor (IGBT) module and the assembling method thereof. The IGBT module comprises at least one IGBT assembly, at least one diode chip assembly and a printed circuit board (PCB), wherein the at least one IGBT assembly and the at least one diode chip assembly are crimped into corresponding holes in the PCB; the PCB is positioned by a PCB positioning block and is arranged between an upper end cover and a lower end cover; an IGBT packaging structure is a laminated structure combined by the least one IGBT assembly and the at least one diode chip assembly. A convex electrode group does not need to be processed, so that processing quantity is reduced, processing efficiency is improved, and the design cost of a new product is reduced. Meanwhile, the size and weight of the module can be reduced, and the all-crimping type IGBT module is simpler and more compact in overall structure, more convenient to manufacture and assemble, higher in connection reliability and better in heat dissipation.
Description
technical field [0001] The invention relates to a power device in the technical field of electric power semiconductor devices and an assembly method thereof, in particular to a fully crimped IGBT (insulated gate bipolar transistor) module and an assembly method thereof. Background technique [0002] Insulated gate bipolar transistor (IGBT) has the characteristics of on-state voltage drop, large current capacity, high input impedance, fast response and simple control, and is widely used in industry, information, new energy, medicine, transportation, military and aviation fields . The press-connect IGBT can dissipate heat on both sides, has excellent heat dissipation effect and high reliability, and exhibits a short-circuit failure mode when the device is damaged, so it is widely used in smart grid and other fields. [0003] In the prior art, some practitioners proposed a press-fit IGBT module (refer to figure 1 , the spring pins and PCB board are not drawn), that is, a plur...
Claims
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