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Packaging method for image sensor

An image sensor and packaging method technology, applied in radiation control devices and other directions, can solve the problems of poor quality of packaging products, high production cost, insufficient reliability, etc. Effect

Active Publication Date: 2013-11-20
上海艾靳智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In traditional image sensor packaging, the image sensor chip is packaged to the substrate by wire bonding, which is likely to cause particle pollution to the sensing area of ​​the image sensor chip, resulting in poor quality and insufficient reliability of the packaged product, and the wire bonding method uses metal wires to achieve For the connection between the chip and the substrate, the substrate needs to reserve a connection area for metal wires, so that the final product package size is much larger than the chip size. The above-mentioned method is complicated in manufacturing process and high in production cost.

Method used

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  • Packaging method for image sensor

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Experimental program
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Effect test

Embodiment 1

[0025] Image sensor packaging methods, such as figure 1 As shown, a light-shielding layer 14 is formed around the first surface 11 of the transparent substrate 1 , and metal rewiring and a plurality of pad networks 13 are formed around the second surface 12 . Such as figure 2 As shown, a plurality of bonding pads 24 are provided on the active surface 21 of the image sensor chip 2 .

[0026] During packaging, the pads 24 on the active surface of the image sensor chip 2 are connected to the pads of the part of the pad network 13 on the metal rewiring on the transparent substrate 1 to form an electrical connection. Covering the transparent substrate can protect the light-sensing area of ​​the chip and prevent particle contamination from subsequent processes.

[0027] Such as Figure 5 As shown, a network of circuit wiring and pads 43 is provided on the first surface 41 of the substrate 4 .

[0028] Such as image 3 or Figure 4 Shown, make closure frame 3 with closure stri...

Embodiment 2

[0033] Such as figure 1 As shown, the transparent substrate 1 includes a first surface 11 and the back side of the first surface (second surface 12 ), and an antireflection film is coated on the first surface 11 of the transparent substrate 1 to increase the transmittance. In an optional embodiment, the part of the first surface of the transparent substrate located in the area surrounded by the light-shielding layer is provided with an anti-reflection film. Of course, the part of the first surface of the transparent substrate located in the area surrounded by the light-shielding layer may not be provided with an anti-reflection film, and the transparent substrate is directly exposed.

[0034] A metal redistribution area is formed around the second surface 12, and a plurality of pad networks 13 are arranged on the metal wiring.

[0035] Such as figure 2 As shown, the image sensor chip 2 includes an active surface 21 and a passive surface 22 on its back side. The active surfa...

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Abstract

The invention provides a packaging method for an image sensor, which comprises the following steps: a transparent base material forming a light-proof layer in a circular manner is arranged at the upper part of an initiative surface of an image sensor chip, and the transparent base material and the initiative surface are correspondingly fixed and connected to form electric connection; the lower end of a seal frame is in counterpoint with a baseplate, and then in fix connection with the baseplate to form electric connection; the upper end of the seal frame is in counterpoint with the transparent base material, and then in fix connection with the transparent base material to form electric connection; the image sensor chip is positioned in a seal space surrounded by the seal frame, the transparent base material and the baseplate; the orthographic projection on the transparent base material is in an area surrounded by the light-proof layer; the periphery of the seal frame is sealed; electric connection of the image sensor chip and the baseplate is realized. Through the adoption of the image sensor acquired by the method, the transparent base material covering the upper part of the initiative surface of the image sensor chip plays a protective effect on a chip sensing area, the particle pollution produced in the follow-up manufacture process is prevented; the process yield can be improved; the light ray is enabled to be injected into the sensing area from a specific area; the light sensation quality is improved, and the qualification rate is improved.

Description

technical field [0001] The invention relates to a chip packaging method, in particular to an image sensor packaging method. Background technique [0002] In traditional image sensor packaging, the image sensor chip is packaged to the substrate by wire bonding, which is likely to cause particle pollution to the sensing area of ​​the image sensor chip, resulting in poor quality and insufficient reliability of the packaged product, and the wire bonding method uses metal wires to achieve For the connection between the chip and the substrate, the substrate needs to reserve a connection area for metal wires, so that the package size of the final product is much larger than the chip size. The above-mentioned method has complicated manufacturing processes and high production costs. Contents of the invention [0003] A brief overview of the invention is given below in order to provide a basic understanding of some aspects of the invention. It should be understood that this summary...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 刘培生
Owner 上海艾靳智能科技有限公司