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Mini-LVDS connecting wire and manufacturing method of mini-LVDS connecting wire

A production method, mini-lvds technology, applied in the field of signal lines, can solve the problems of high market price and high production cost of connecting lines, and achieve the effects of high welding defect rate, high labor cost, and low quality yield rate

Inactive Publication Date: 2013-11-20
SHENZHEN DEREN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned traditional Mini-LVDS connecting wire has the following defects: the entire core wire is made of Teflon wire, because it has the advantages of excellent thermal stability and mechanical wear-resistant electrical insulation performance compared with other high-temperature wires, so it has a higher market price. Makes the production cost of the connection line relatively high

Method used

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  • Mini-LVDS connecting wire and manufacturing method of mini-LVDS connecting wire

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Embodiment Construction

[0036] The invention is an innovation based on the standard Mini-LVDS, and is a new type of signal transmission line applied to electronic equipment such as high-resolution notebook computers, liquid crystal displays, and tablet computers.

[0037] The main features of the Mini-LVDS connecting wire in the present invention are: ① wire material: the core wire adopts flat FFC and Teflon wire, which reduces production costs; The FFC and the other ends of the two flat FFCs are welded to the connector structure, which simplifies the production process; ③ Connector: An integrated connector is used, which is directly buckled on one end of the flat FFC, improving product yield and reducing manufacturing costs.

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embo...

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Abstract

The invention provides a Mini-LVDS (Low Voltage Differential Signaling) connecting wire and a manufacturing method of the Mini-LVDS connecting wire. The Mini-LVDS connecting wire comprises a first LVDS connector, a first FFC (Flexible Flat Cable), a Teflon wire, a second FFC and a second LVDS connector, wherein the first FFC as well as the second FFC comprises an upper-layer insulating leather film, a plurality of flat copper wires arranged side by side and a lower-layer insulating leather film, which are jointed together; the ends of the flat copper wires are exposed; the ends of the flat copper wires are welded with the Teflon wire; the other ends of the flat copper wires are assembled with the first LVDS connector and the second LVDS correspondingly; the middle parts of the core wires of the Teflon wire are wrapped to form a cylinder; the ends of the core wires are exposed and are respectively welded with the first FFC and the second FFC. According to the Mini-LVDS connecting wire, the Teflon wire adopts the smallest length, so that the production cost is greatly reduced; the integrated LVDS connectors are adopted so as to improve the quality and yield of products, simplify the manufacture process, reduce manual operation and greatly improve the production efficiency.

Description

technical field [0001] The invention relates to the technical field of signal lines, in particular to a Mini-LVDS (miniature low-voltage differential signal) connection line and a manufacturing method thereof. Background technique [0002] LVDS (Low Voltage Differential Signaling) is a small-amplitude differential signal technology that uses a very low-amplitude signal (about 350mV) to transmit data through a pair of differential PCB traces or balanced cables. Mini-LVDS is an interface technology that takes up less space and has LVDS functions. It plays an important role in the advancement of notebook computers and LCD displays to high resolution. The application of Mini-LVDS can reduce the number of signal lines in the LCD control module by 60%. Therefore, when manufacturers develop full-flat displays, they can not only simplify the design and layout of the circuit board, but also increase the working efficiency of the product and reduce the The cost of the system, reducin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R31/06H01R24/00H01R13/02H01R13/502H01R43/00H01B7/17
Inventor 田南律熊国军
Owner SHENZHEN DEREN ELECTRONICS
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