[0021] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0022] See figure 1 with Figure 5 As shown, the embodiment of the present invention provides a laser processing device, including a bed 1, a beam 3, a laser processing system, and a software control system (not shown in the figure). The laser processing system includes an optical transmission system 2 and a laser processing component. At least two movable positioning work platforms 8 are arranged on the bed 1; the laser processing assembly is arranged on the beam 1, and can move back and forth on the beam 1. When the laser processing assembly finishes processing one of its positioning work After the processed parts on the platform 8 are moved to the next positioning workbench 8 for processing; the laser processing assembly is arranged above the positioning work platform 8, which is located directly above the positioning work platform 8 to be processed during processing , It is convenient for the laser processing component to process the workpiece, and the laser processing component is located obliquely above other positioning work platforms. The laser processing assembly described in the embodiment of the present invention is one set, and the processing parts on at least two positioning work platforms 8 are processed through this set of laser processing assembly, thereby greatly improving the processing efficiency.
[0023] Such as figure 1 As shown in Figure 4, the processing device according to the embodiment of the present invention includes an X-axis unit 5 for optical transmission and positioning of the laser beam of the optical transmission system 2. A Z-axis unit 7 is provided on the X unit 5, and the laser The processing device is arranged on the Z-axis unit 7, and the bed 1 is provided with a Y-axis unit 6 that carries and moves the positioning work platform.
[0024] Such as figure 1 with Figure 5 As shown, the optical transmission system 2 according to the embodiment of the present invention includes a beam expander 22, a first reflector 23, a second reflector 24, a third reflector 25, and a fourth reflector 26; the beam expander 22. The first reflector 23 and the second reflector 24 are installed on the beam 3, and the fourth reflector 26 is installed on the Z-axis unit 7; Figure 5 As shown, the light path of the optical transmission system 2 is that the laser beam emitted by the laser 21 passes through the beam expander 22. After the beam is expanded, the laser beam passes through the first mirror 23, the second mirror 24, the third mirror 25, and The fourth mirror 26 enters the galvanometer scanning system 27 again.
[0025] Such as figure 1 with Figure 5 As shown, the laser processing assembly according to the embodiment of the present invention includes a laser 21, a CCD positioning system 9, a galvanometer scanning system 27, and a focusing lens 28. The laser 21 is preferably an ultraviolet laser, which is installed on the beam 3. The CCD positioning system 9 includes a CCD scanning device 91, a lens 92 and a light source 93. The CCD positioning system 9, a focusing lens 28 and a galvanometer scanning system 27 are arranged on the Z-axis unit 7. In the embodiment of the present invention, by arranging the laser processing system on the X-axis unit 5 and the Z-axis unit 7, the laser beam can be better transmitted and positioned to achieve precise processing effects.
[0026] Such as figure 1 - Figure 4 As shown, the positioning work platform 8 described in the embodiment of the present invention is a vacuum suction positioning work platform for adsorbing the workpiece to be processed on the positioning work platform 8. The positioning work platform 8 may be multiple, and this embodiment uses Take two as examples, which include positioning work platforms 81 and 82 movably arranged on the Y-axis unit 6. The Y-axis unit 6 includes a Y1-axis unit 61 and a Y2-axis unit 62, the driving device is a Y-axis power device, and the Y-axis power device includes a Y1-axis power device 612 and a Y2-axis power device 622; Two positioning work platforms 81 and 82 are respectively arranged on the Y1-axis unit 61 and Y2-axis unit 62, which are driven by the Y1-axis power device 612 and Y2-axis power device 622 respectively. During the processing, the galvanometer scanning system 27 It moves relative to the positioning work platform 8 to ensure the accuracy of processing.
[0027] Such as figure 1 As shown in -4, the X-axis unit 5 according to the embodiment of the present invention includes an X-axis guide rail assembly, an X-axis grating ruler 52, an X-axis power device 53 and an X-axis fixing plate 54. The X-axis guide rail assembly includes an X-axis guide rail 51 And the X-axis slider 54, the X-axis guide rail assembly and the X-axis grating ruler 52 are mounted on the beam 3, the X-axis power device 53 is movably arranged on the X-axis guide rail assembly, and the third mirror 23 is set On the X-axis fixed plate 54.
[0028] Such as Figure 1-4 As shown, the Y-axis unit 6 according to the embodiment of the present invention includes a Y1-axis unit 61 and a Y2-axis unit 62. The Y1-axis unit 61 includes a Y1-axis guide rail assembly, a Y1-axis power device 612, a Y1-axis grating ruler 613, and Y1-axis motor fixing plate 614, the Y1-axis guide rail assembly includes Y1-axis guide rail 611 and Y1-axis slider 615; the Y2-axis unit 62 includes Y2-axis guide rail assembly, Y2-axis power device 622, Y2-axis grating ruler 622 and Y2 Axis motor fixing plate 624, the Y2-axis guide rail assembly includes Y2-axis guide rail 621 and Y2-axis guide rail slider 625; the Y1-axis guide rail assembly, Y2-axis guide rail assembly, Y1-axis grating ruler and Y2-axis grating ruler are installed on the bed 1, the Y1-axis power device 612 and the Y2-axis power device 622 are respectively arranged on the Y1-axis guide rail assembly and the Y2-axis guide rail assembly. The Y1-axis power device 612 and the Y2-axis power device 622 respectively drive two positioning work platforms 8 to move.
[0029] Such as Figure 1-4 As shown, the Z-axis unit 7 according to the embodiment of the present invention is arranged on the X-axis fixed plate 54. The Z-axis unit 7 includes a Z-axis power device 71, a Z-axis bottom plate 72, a Z-axis guide rail 73 and a Z-axis slider 74. The Z-axis power device 71 is arranged on the X-axis fixed plate 54, and the fourth mirror 26, the galvanometer scanning system 27, and the focusing mirror 28 are arranged on the Z-axis base plate 72; according to the embodiment of the present invention An X-axis fixed plate 54 is movably provided on the X-axis guide rail assembly. The X-axis fixed plate 54 can move back and forth on the X-axis guide rail assembly. The Z-axis unit 7 is set on the X-axis unit 5 through the X-axis fixed plate 54. on. The said Z-axis bottom plate is also provided with a dust suction device 10, which is used for vacuuming the positioning work platform 8 during the processing.
[0030] The embodiments of the present invention can be applied to laser cutting, laser marking, laser drilling, etc. in the laser field. The following takes the laser cutting of PCB board as an example to illustrate the operation process.
[0031] Such as figure 1 As shown in Figure 5, the processing device of the embodiment of the present invention also includes a software control system. When the PCB board is cut and processed, the PCB board is pre-mounted, and the laser beam emitted by the laser 21 is first reflected by the optical transmission system 2 into the vibration The mirror scanning system 27 is then reflected by the galvanometer scanning system 27 into the focusing mirror 28. The focusing mirror 28 then focuses the laser beam emitted by the laser 21 into a small spot. The swing of the galvanometer scanning system 27 controls the spot on the positioning work platform The two-dimensional coordinates and accuracy on 8 are processed by the galvanometer scanning system 27 using the spot focused by the focusing lens 28. The software control system of the embodiment of the present invention sets the initial parameters of the PCB to be processed. The laser energy setting of the laser 21, the processed graphics, the positioning of the CCD positioning system 9, and the movement of the alternate loading and unloading worktable 8 are all controlled by the software. The control system is uniformly deployed.
[0032] When cutting PCB boards, the embodiment of the present invention is suitable for the laser cutting of PCB soft boards, hard boards and soft-hard combined boards in the SMT patch industry. Two or more working platforms are used for processing alternately, one set of laser processing The system is used for processing and is driven by a linear motor. It has a fast response speed, saves loading and unloading time, and greatly improves the processing efficiency. The laser processing has neat and clean edges, no burrs, and high profile accuracy, which can reach +/-0.020mm. At the same time, the invention can add a line manipulator to realize automatic loading and unloading, save labor, and fully realize automatic production.
[0033] Such as figure 1 with figure 2 As shown, the operation process of the processing device in this embodiment is: first attach the SMT patch PCB board to be processed on the positioning work platform 8, and import the files needed to be processed by the SMT patch PCB into the software control system, and then start Set the initial parameters of processing. The main initial parameters include laser frequency, pulse width, processing speed, and plate thickness. After setting the parameters, you can use the positioning light output by the laser to find the starting point that needs to be processed. After selecting it, click the start button. One of the positioning work platforms is driven by a linear motor to send the SMT patch PCB to be processed to the processing area. The software control system simultaneously controls the laser 21 to emit laser, the galvanometer scanning system 27, and the positioning work platform 8 to move for processing. During processing, the laser beam emitted by the laser 21 passes through the beam expander 22. After beam expansion, the laser beam passes through the first mirror 23, the second mirror 24, the third mirror 25, and the fourth mirror 26 and enters the galvanometer for scanning. In the system 27, the outgoing beam enters the focusing mirror 28 again. The focusing mirror 28 focuses the laser beam into a small spot, and then uses this small spot for processing. After the processing is completed, click the conversion processing button, and another positioning work platform 8 is also driven by a linear motor to send the SMT patch PCB to be processed to the processing area, and at the same time, the SMT patch PCB processed by the first positioning work platform 8 is transferred Come out, and then replace the SMT patch PCB that needs to be processed. Repeat the above operations to save loading and unloading time. The CCD positioning system 9 prevents relative movement between the processing plate and the platform; the high-frequency laser 21 can achieve good processing results; the high-speed galvanometer scanning system 27 improves the processing speed; the high-precision galvanometer scanning system 27 and The relative movement of the positioning work platform 8 ensures the high precision of the size of the workpiece. The dust suction device 10 takes away the generated dust, thereby avoiding the pollution of the dust to the environment and the harm to the human body.
[0034] The laser in the embodiment of the present invention is an ultraviolet laser, a green laser or a fiber laser; the power device is a driving device or a transmission device, and the driving device may be a linear drive motor, a screw drive motor, and the like.
[0035] The above are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc., made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
