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Laser processing apparatus and method of controlling the same

A laser processing device and laser processing technology are applied in post-processing, post-processing details, laser welding equipment, etc., which can solve problems such as difficult to reduce laser processing time and complex structures, and achieve simplification of substrate alignment operations and realization of Mass production, time and cost reduction effects

Active Publication Date: 2013-11-27
AP SYST INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, since a general-purpose laser processing apparatus irradiates a laser beam to the entire substrate to perform laser processing, and the laser beam irradiates even a portion of the substrate that does not need to be processed, it is difficult to reduce the time for laser processing
[0010] In addition, since a substrate crystallized by a general-purpose laser processing device requires a separate measuring instrument in post-process to align the substrate with respect to the cell and panel, the The device for substrate alignment has a complex structure

Method used

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  • Laser processing apparatus and method of controlling the same
  • Laser processing apparatus and method of controlling the same
  • Laser processing apparatus and method of controlling the same

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Embodiment Construction

[0036] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the drawings are not drawn to exact scale, but may be exaggerated in terms of line thickness and feature size for ease of description and clarity. As used herein, the terms "a", "an" and "the" in the singular are intended to include the plural unless expressly stated otherwise. Also, terms used herein are defined by considering the functions disclosed herein, and can be changed according to user's or operator's habit or intention. Accordingly, definitions of terms should be based on the full text given here.

[0037] figure 1 is a perspective view of a laser processing device according to an embodiment of the present invention; figure 2 is a schematic diagram of a reaction chamber and a marking unit of a laser processing apparatus according to an embodiment of the present invention; and image 3 is a plan view of a substra...

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Abstract

PURPOSE: A laser processing apparatus and a control method thereof are provided to form a reference point for laser processing on a substrate, thereby easily performing alignment of substrates and post-processes. CONSTITUTION: A display unit(20) is provided in a reaction chamber and forms a reference point in a substrate. A sensing unit(26) senses the position of the substrate or the reference point. A driving unit moves a stage. A control unit transmits an operation signal to the display unit or the driving unit.

Description

technical field [0001] The present invention relates to a laser processing device and its control method, in particular to a laser processing device and its control method. The laser processing device can selectively perform laser processing on only the part of the substrate to be laser processed, simplifying the use of The laser-processed substrate is aligned, and the substrate can be aligned in subsequent processing without using a separate measuring instrument when performing the processing. Background technique [0002] In the manufacture of semiconductor devices, flat panel display (FPD) devices, or solar cell devices, etc., when depositing thin films at high temperatures, thermochemical reactions may contaminate the reactor or may generate unwanted compounds. [0003] Thus, laser-induced plasma chemical vapor deposition is used to deposit thin films at low temperatures. [0004] Meanwhile, since it is difficult to secure uniformity at the time of film deposition and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B33/02H01L21/324B23K26/02B23K26/00H01L21/268
CPCB23K26/02H01L21/67259H01L21/68
Inventor 郑尚玄沈亨基洪起垣崔均旭
Owner AP SYST INC
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