Laser processing apparatus and method of controlling the same
A laser processing device and laser processing technology are applied in post-processing, post-processing details, laser welding equipment, etc., which can solve problems such as difficult to reduce laser processing time and complex structures, and achieve simplification of substrate alignment operations and realization of Mass production, time and cost reduction effects
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[0036] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the drawings are not drawn to exact scale, but may be exaggerated in terms of line thickness and feature size for ease of description and clarity. As used herein, the terms "a", "an" and "the" in the singular are intended to include the plural unless expressly stated otherwise. Also, terms used herein are defined by considering the functions disclosed herein, and can be changed according to user's or operator's habit or intention. Accordingly, definitions of terms should be based on the full text given here.
[0037] figure 1 is a perspective view of a laser processing device according to an embodiment of the present invention; figure 2 is a schematic diagram of a reaction chamber and a marking unit of a laser processing apparatus according to an embodiment of the present invention; and image 3 is a plan view of a substra...
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