BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter

Abstract

The invention discloses a BGA (Ball Grid Array) ball embedding method using an SMT (Surface Mounting Technology) chip mounter. The BGA ball embedding method using the SMT chip mounter comprises the steps of: placing a solder ball carrier plate which carries a solder ball in a feeding region of a disc-shaped carrying device of the chip mounter; fixing a BGA carrier plate fixed with a BGA to the orbit of the chip mounter; and packaging the solder ball on a BGA bonding pad by using a suction nozzle of the chip mounter through special BGA ball embedding chip mounting procedures. The method simplifies BGA ball embedding operation process as the existing SMT chip mounter equipment in the production is utilized, saves cost as the BGA ball embedding chip mounting procedures which are applicable for all BGA are adopted, and a special screen plate is unnecessary to produce, and achieves a fast production response speed as the time taken for producing the screen plate is left out. In addition, as the ball embedding position, pressure and speed are controlled automatically by the high-precision chip mounter, all the parameters are controllable, the ball embedding quality is high, and the method is suitable for BGA ball embedding in batches. Furthermore, as the standard solder ball is used, the ball embedding height is consistent with a brand-new device, the height is restorable and strong universality is achieved.

Description

technical field [0001] The invention relates to the field of BGA processing, in particular to a method for planting BGA balls by using an SMT placement machine. Background technique [0002] In the SMT assembly technology, the ball grid array package (BGA) has the characteristics of a large number of solder joints and is hidden under the package, which makes it difficult to control the mounting quality, thus making it difficult to achieve good soldering of the BGA. When repairing a poorly mounted BGA, it needs to be disassembled, which will inevitably cause damage to the solder balls at the bottom of the BGA. To reinstall the BGA, it is necessary to restore the integrity of the solder balls, and the method is to replant the balls. The first step of any ball planting method needs to clean the bottom of the BGA pad, but there are differences in how to plant the balls. [0003] At present, there are two main ball planting methods adopted by various SMT production lines at hom...

AI Technical Summary

Problems solved by technology

The production speed of this invention is relatively fast and the cost is relatively low. However, due to the use of solder paste for ball planting, the thickness of the stencil and the diameter of the pad opening limit the amount of solder paste, which will lead to a height difference between the reworked BGA and the original package. The gap is large, and the height of the solder balls cannot be restored. It cannot be used for processes that require a high degree of device coordination.

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